Start main contents

Products: Semiconductors & Devices

Contact Image Sensors (CIS)

Specifications and Features of Banknote Applications

By developing a high-sensitivity CMOS sensor IC and high-efficient illumination system, we have achieved one of the fastest scanning CIS in the world at 20μs / line / color. We offer CIS which are capable of supporting up to 16 light sources, including visible light, infrared, UV, and transmitted light.

Specifications

XD2F100AX UD2F200AX UE2G200AX XG2G100AX (under development)
Scan width (total scan width) 100㎜ (109.8㎜) 200㎜ (207.4㎜) 200㎜ (207.4㎜) 100㎜ (109.8㎜)
Valid pixels (total pixels) 788 (864) pixels 1,575 (1,632) pixels 1,575 (1,632) pixels 788 (864) pixels
Pixel density 200 / 100dpi
Output clock frequency 40MHz 16MHz 16MHz 55MHz
Scan speed* 30μs / line・color* 120μs / line・color* 120μs / line・color*(100dpi)
250μs / line・color*(200dpi)
15μs / line・color*
Electric current 5 [V] x 0.5 [A] max 5 [V] x 0.5 [A] max 5 [V] x 0.5 [A] max TBD
Data output method 10-bit length digital output (LVDS**) 10-bit length digital output (LVTTL***) 10-bit length digital output (LVTTL***) 10-bit length digital output (LVDS**)
Light source Reflective (R, G, B, IR)
Transmitted (1 color of R, G, B, IR)
Reflective (R, G, B, IR)
Transmitted (1 color of R, G, B, IR)
Reflective (R, G, B) Reflective (R, G, B, IR)
Transmitted (1 color of R, G, B, IR)
Focal point 1.0㎜ above glass surface
Rod lens 20° 20° 12° 12°
External dimensions 128(L) x 25(W) x 12(H)㎜
Including flange (L) = 144㎜
229(L) x 25(W) x 12(H)㎜ 229(L) x 15(W) x 12(H)㎜ 128(L) x 25(W) x 12(H)㎜
Including flange (L) = 144㎜
Features Width 15㎜ High-speed specifications

* Note
The specifications provided above are for reference only. We customize CIS for banknote applications based on customers’ requirements.

* In the case of using three kinds of light source. If four or more different kinds of LEDs are used, the speed must be reduced, because there is a limitation in the number of LED chips mounted on our LED boards.

** LVDS:Low Voltage Differential Signaling

*** LVTTL:Low Voltage Transistor Transistor Logic

Features

1. Light source development Illumination (system) development

Mitsubishi Electric has achieved unique illumination (system) that satisfies customers’ needs by leveraging development through optical simulation.

2. UV illumination

Mitsubishi Electric CIS provide uniform illumination through development based on decades of experiences for UV light source CIS.

3. In-house fabrication of step-less transfer face structure

Contact plates composed of glass and resin frame are produced in-house and have steps between the glass plate and resin frame less than 30μm, which is called the Glass-Plastic-Flatness (GPF) process.

4. Hologram scanning

Hologram scanning is possible with CIS, thanks to the multi-axis ability of light sources. This technology is used for banknote inspection as in ATM and cash handling machines.

Inquiries

Please feel free to contact us if you have any questions regarding this CIS or its introduction.

Page Top