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Laser Drilling Machines GTW4-UVF20 Series

Laser Drilling Machines GTW4-UVF20 Series

Feature

2-beam-2-panel UV laser drilling machine allows for excellent via formation on flexible printed circuit boards

■Flexible substrate drilling machine

"UV laser oscillator" with laser wavelength of 355nm suitable to processing of Polyimide, main material of flexible substrate, realizes stable processing quality.

■High speed trepanning

High speed UV laser oscillator, Mitsubishi Electric original galvano scanner and newly developed control method named "Synchrom" technology achieve high productivity and stable processing quality.

■Stable mass-production

Reel-to-Reel (RtoR) sheet transfer device applicable to 250/260mm wide is equipped. Stable mass-production of roll material is realized.