DDR SDRAM modules with up to a PC2700 speed grade will be built with DDR SDRAM chips that have up to a DDR333 speed grade, depending on the configuration. PC2700 DDR SDRAM modules support a 2.7-Gbyte-per-second data transfer rate. SDR SDRAM modules will be available in the PC133 speed grade.
"Moving to the 0.15-m m CMOS process technology enables Mitsubishi Electric to offer several types of high-density DDR and SDR SDRAM module families sought by customers who make high-end servers and workstations," said Sudeep Sharma, associate vice president of memory marketing at Mitsubishi Electric & Electronics USA, Inc. "For example, customers who develop servers for Internet Web hosting or make workstations for high-end electrical and mechanical CAD applications must have the highest-density DRAMs available for their products."
"Our process technology and packaging expertise help to drive Mitsubishi Electric’s second-generation 256-Mbit DDR and SDR SDRAM chips into our extremely small sTSOP packaging," adds Sharma. "These factors converge to make our exceptionally fast PC2700 high-density SO-DIMMs available, with no DRAM stacking required, to customers who build high-end notebook PCs. In summary, Mitsubishi Electric’s transition to the 0.15-m m technology gives customers dramatically expanded module options to consider for their high-end system designs."
Mitsubishi Electric uses 32 or 36 DRAM chips to make its 2-Gbyte and 1-Gbyte registered DIMMs, depending on whether the modules use 512- or 256-Mbit devices. The 512-Mbyte SO-DIMMs use 16 256-Mbit DRAM chips.
Availability
Samples of 2-Gbyte registered DIMMs will be available in December 2001, with volume
production scheduled for the first quarter of 2002. Samples of 1-Gbyte registered DIMMs
and 512-Mbyte SO-DIMMs will be available in November 2001, with volume production
scheduled for the first quarter of 2002.
Complete families of registered DIMMs and SO-DIMMs will be available. Here are the product numbers for a few leading-edge modules:
# # #
Definitions:
(1) DDR — Double Data Rate
(2) SDR — Single Data Rate
(3) DIMM — Dual In-line Memory Module
(4) SO-DIMM — Small Outline DIMM
(5) sTSOP — small TSOP (Thin Small Outline Package)
About Mitsubishi Electric & Electronics USA, Inc.
Mitsubishi Electric Corporation is one of the world’s top-10 DRAM suppliers and
aggressively develops advanced DRAMs, such as DDR and SDR SDRAMs, RDRAM®, and other
emerging industry-standard DRAM types to support current and future customer requirements.
Mitsubishi Electric is the first company to successfully integrate the process
technologies of DRAM and processor logic with its highly acclaimed eRAM™
system integration technology, and has shipped embedded DRAM products in high volume for
longer than any other supplier. eRAM is Mitsubishi Electric’s brand name for
its silicon process technology, products, and systems expertise that integrate memory and
system-level core functions on the same integrated circuit to enable unprecedented overall
system performance.
A top-tier semiconductor supplier, Mitsubishi Electric markets memory products and an extensive range of other semiconductors in North America through the Electronic Device Group of Mitsubishi Electric & Electronics USA, Inc. Additional information on the Mitsubishi Electric Semiconductor Group is available at http://www.mitsubishichips.com/.
Trademark Information
eRAM is a trademark of Mitsubishi Electric & Electronics USA, Inc. RDRAM is a
registered trademark of Rambus Inc. All other companies and products referenced herein are
trademarks or registered trademarks of their respective holders.
For More Information:
Positio Investor & Public Relations
Dave Richardson
(650) 815-1006, Ext. 108
dave@positiopr.com
Mitsubishi Electric & Electronics USA, Inc.
John Garner
(408) 774-3191
garner_john@edg.mea.com
