SUNNYVALE, Calif. — September 30, 2002 — The Electronic Device Group of Mitsubishi Electric & Electronics USA, Inc., today announced that its parent, Mitsubishi Electric Corporation, and the Electronic Component Group of Kyocera Corporation have introduced the world’s smallest triple-band compatible E-GSM^[1]/DCS^[2]/PCS^[3] transmitter module for cellular phone applications. The second product in a highly integrated transmitter module family jointly developed by the two companies, the device occupies only 0.1 cubic centimeter — a 50 percent size reduction from the family’s first product, introduced in July 2001. It also improves the effective power-amplifier efficiency by 5 to 8 percent, compared to a conventional power amplifier module solution.

"The newest transmitter module from Mitsubishi Electric and Kyocera achieves a higher level of integration than ever before, combining three bands in a module that is 50 percent smaller," said Bryon Gutow, senior product marketing manager for microwave and RF products at Mitsubishi Electric & Electronics USA, Inc. "The triple-band transmitter coverage enables cellular phone designs to be leveraged across several markets, thereby reducing development costs. In addition, the space savings enabled by the transmitter module’s dramatically reduced package size permits customers to integrate more advanced components into next-generation cellular phones, so they can deliver more powerful and sophisticated functionality."

The new transmitter module attains its remarkably small size primarily through design improvements that enable an 83 percent size reduction of the RF section area, compared to traditional discrete circuitry. The transmitter module integrates an antenna switch module, RF power amplifier, and RF output power monitor coupler in the same unit, along with an EN61000-compliant electrostatic discharge (ESD) protection circuit.

The module features Mitsubishi Electric’s new high efficiency InGaP^[4] HBT^[5] MMIC^[6] design and manufacturing technologies and Kyocera’s high Q-factor LTCC^[7] substrate and low-loss antenna switch technologies. The module achieves power efficiency improvements on the antenna terminal of the module by combining the high-efficiency InGaP HBT MMIC, power amplifier, and low-loss antenna switch module together and optimizing the design of the antenna switch circuit and matching circuit. The power efficiency at the antenna is 43 percent for E-GSM applications and 36 percent for DCS/PCS applications. At the power amplifier, this is equivalent to a power efficiency of 60 percent for E-GSM applications and 56 percent for DCS/PCS applications. The module’s high integration makes designing an external impedance-matching circuit unnecessary, thereby shortening design cycle time, saving engineering resources, and reducing product development costs.

Availability

Mitsubishi Electric and Kyocera will sample the E-GSM/DCS/PCS triple-band transmitter module in October 2002, with volume production scheduled for June 2003.

Mitsubishi Electric will sell the product under the part number BA01303.

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Definitions:

[1] E-GSM = Enhanced-Global System for Mobile Communication

[2] DCS = Digital Cellular System

[3] PCS = Personal Communication Service

[4] InGaP = Indium Gallium Phosphide

[5] HBT = Hetero-junction Bipolar Transistor

[6] MMIC = Microwave Monolithic Integrated Circuit

[7] LTCC = Low Temperature Co-fired Ceramic

About Kyocera Corporation

Kyocera Corporation, the parent and global headquarters of the Kyocera Group, was founded in 1959 as a producer of advanced ceramics. By combining these engineered materials with metals and plastics, and integrating them with other technologies, Kyocera has become a leading supplier of telecommunications equipment, semiconductor packages, electronic components, cameras, laser printers, copiers, solar energy systems and industrial ceramics. During the year ended March 31, 2002, Kyocera Corp.'s consolidated net sales totaled 1,034,574 million JPY (US$ 7.78 billion) with net income of 31,953 million JPY (US$ 240.25 million).

Additional information on the Kyocera Group is available at: http://global.kyocera.com.

About Mitsubishi Electric & Electronics USA, Inc.

Mitsubishi Electric Corporation manufactures a diverse range of microwave and RF semiconductors for linear, low-noise, and high-power communications applications, including satellite and terrestrial transmitters and receivers, mobile radios, cellular phones, and subscriber units. The company produces gallium-arsenide (GaAs) FETs, modules, and MMICs using HBT, PHEMT, MESFET, HEMT, and HFET technologies. The company also produces silicon RF power transistors and modules using MOS and LDMOS technologies for the industrial and consumer markets. Mitsubishi Electric markets its microwave and RF semiconductors in North America through the Electronic Device Group of Mitsubishi Electric & Electronics USA, Inc.

Mitsubishi Electric Corporation and its North American affiliate, Mitsubishi Electric & Electronics USA, Inc., are world-class suppliers of semiconductors and electronic products for communications, industrial, Internet-enabled, automotive, and visual applications. Mitsubishi Electric combines its systems-level expertise and high-level silicon process technologies to provide chip, chipset, and system-on-chip solutions. The company is ranked among the top-tier worldwide semiconductor suppliers and offers an extensive range of semiconductor and computer system components for the North American marketplace, including DRAM, flash, SRAM, ASIC, ASSP, MCU, microwave/RF, and optoelectronic devices.

Additional information on the Mitsubishi Electric Semiconductor Group is available at http://www.mitsubishichips.com.

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Positio Investor & Public Relations (for Mitsubishi Electric)
Dave Richardson
(650) 815-1006, Ext. 108
dave@positiopr.com