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Mitsubishi Electric Introduces Ultra-Small Mobile Phone Power Amplifier Module for W-CDMA Applications
SUNNYVALE, Calif. July 16, 2002 The Electronic Device Group of
Mitsubishi Electric & Electronics USA, Inc., introduced an ultra-small gallium
arsenide (GaAs) hetero-junction bipolar transistor (HBT) that is 35 percent smaller than
todays power amplifier modules for W-CDMA[1] applications. Housed in a 6-
x 6- x 1.5-mm package, the super small BA01212 power amplifier was developed in response
to the constant demand to drive down the size and weight of mobile phones.
With increasing functionality demanded from todays mobile phones for e-mail, packet communication and Internet access, as well as demands for longer talk-time performance, module power efficiency is a critical factor. To achieve this, Mitsubishi Electric developed a new transistor structure to optimize the transistor size and module circuit configuration. With this new transistor structure, the BA01212 is able to achieve a low operating voltage of 3.5 volts (V) and a low idle current of 50 milliamps (mA).
"The fashionable mobile phone and device user is constantly demanding smaller handsets," said Bryon Gutow, senior product marketing manager for microwave and radio frequency products at Mitsubishi Electric & Electronics USA, Inc. "The BA01212 allows that trend to continue. Low idle current performance at low radio frequency output operation is key to the W-CDMA system. We have optimized low idle current at 50 mA, realizing a 42 percent high efficiency rate and in turn extending talk-time performance."
In addition to the ultra-small package size, the GaAs HBT technology also eliminates the need for additional peripheral circuitry, further reducing size and space requirements. The BA01212 requires only a positive voltage, thereby making negative voltage generation circuits unnecessary. Similarly, integrating internal matching circuits that optimize distortion performance eliminates the need for external matching circuits.
Packaging and Availability
The BA01212 GaAs HBT is housed in a 6- x 6- x 1.5-mm LTCC[2] substrate package with a metal cap. The device is available now in volume production.
Key Features
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Definitions
[1] W-CDMA = Wideband Code-Division Multiple Access
[2] LTCC = Low Temperature Cofired Ceramic
About Mitsubishi Electric & Electronics USA, Inc.
Mitsubishi Electric Corporation manufactures a diverse range of microwave and RF
semiconductors for linear, low-noise, and high-power communications applications,
including satellite and terrestrial transmitters and receivers, mobile radios, cellular
phones, and subscriber units. The company produces gallium-arsenide (GaAs) FETs, modules,
and MMICs using HBT, PHEMT, MESFET, HEMT, and HFET technologies. The company also produces
silicon RF power transistors and modules using MOS and LDMOS technologies for the
industrial and consumer markets. Mitsubishi Electric markets its microwave and RF
semiconductors in North America through the Electronic Device Group of Mitsubishi Electric
& Electronics USA, Inc.
Mitsubishi Electric Corporation and its North American affiliate, Mitsubishi Electric & Electronics USA, Inc., are world-class suppliers of semiconductors and electronic products for communications, industrial, Internet-enabled, automotive, and visual applications. Mitsubishi Electric combines its systems-level expertise and high-level silicon process technologies to provide chip, chipset, and system-on-chip solutions. The company is ranked among the top-tier worldwide semiconductor suppliers and offers an extensive range of semiconductor and computer system components for the North American marketplace, including DRAM, flash, SRAM, ASIC, ASSP, MCU, microwave/RF, and optoelectronic devices.
Additional information on the Mitsubishi Electric Semiconductor Group is available at http://www.mitsubishichips.com/.
Keywords
Mitsubishi, CDMA, W-CDMA, GaAs, hetero-junction bipolar transistor, HBT.
For More Information:
Positio Investor & Public Relations
Dave Richardson
(650) 815-1006, Ext. 108
dave@positiopr.com
Mitsubishi Electric & Electronics USA, Inc.
John Garner
(408) 774-3191
garner_john@edg.mea.com