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FOR IMMEDIATE RELEASE No.2562

Mitsubishi Electric and Infineon Technologies Collaborate to Standardize IGBT Module Package

Two companies to supply compatible packages for easy replacement

Tokyo, Japan, November 1, 2010 - Mitsubishi Electric Corporation (TOKYO: 6503) and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced today that they have collaborated to standardize the packages of insulated gate bipolar transistor (IGBT) modules used in inverters for motor control systems in industrial machinery. The Smart Series packaging will be used by the two companies to make IGBT module packages compatible, enabling the packages to be easily replaced by inverter manufacturers.

Smart Series packages can be mounted solder-less on printed circuit boards and heat sinks with a single screw, which makes assembly of inverters easy. These packages were first developed by Infineon Technologies for 2.2kW to 11kW inverters as SmartPACK, a 6-in-1 package, and SmartPIM, a CIB type that incorporates a converter, an inverter and a brake chopper in one package. Mitsubishi Electric has now agreed with Infineon Technologies to launch IGBT modules that share the same packaging.

Furthermore, Mitsubishi Electric and Infineon Technologies will jointly develop packages for IGBT modules to be used in inverters of up to 55kW, each planning to market their products gradually from April 2011. In these modules, the two companies will incorporate their own IGBT chips, available in 600V and 1200V, and ranging from 15A to 200A.
A Smart Series package mounted solder-less on a printed circuit board

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