Semiconductors & Devices

Power Modules for Power Applications : Motion ControlPower Modules for Power Applications : Motion Control

IGBT and IPM modules are indispensable devices for industrial inverter and servo drive applications.

Features of Mitsubishi Electric power modules for motion control

  • CSTBT1 TM chips
  • Low power losses and low thermal impedance
  • Small gate capacitance
  • Improved dv/dt controllability by gate resistance (Seventh Generation IGBT modules)
  • PC-TIM2 preapplied thermal interface material (Option for Seventh Generation IGBT modules)
  • 1 : CSTBT is Mitsubishi Electric’s original IGBT chip construction incorporating carrier-store effect.
  • 2 : Phase Change Thermal Interface Material

System Block Diagram

  • 2-level inverter
  • I-type multi-level (3-level) inverter
  • T-type multi-level (3-level) inverter

Power Module Map

  • Click series titles for more information.

Note) HVIC: High Voltage IC to drive power MOSFET and IGBT module

Note) HVIC: High Voltage IC to drive power MOSFET and IGBT module

100V Nominal MOSFET module

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