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Semiconductors & Devices

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Mitsubishi Electric ADVANCE

Bodo's Power Systems

Mitsubishi Electric ADVANCE

Publication Date Title PDF
Sep. 2016 Overview Opens in new window PDF:16.6KB
7th Generation Power Chip Technologies for Industrial Application Opens in new window PDF:1,988KB
Packaging Technology for Highly Reliable Industrial Power Modules Opens in new window PDF:2,572KB
7th Generation IGBT Module "T Series" for Industrial Applications Opens in new window PDF:2,940KB
7th Generation IPM "G1 Series" for Industrial Applications Opens in new window PDF:2,689KB
All-in-One Type DIPIPM with Built-In Converter, Inveter and Brake Opens in new window PDF:2,662KB
Mar. 2015 Overview Opens in new window PDF:26.7KB
Super Mini DIPIPM "Ver.6 Series" Opens in new window PDF:108KB
Hybrid SiC Modules for High-Frequency Applications Opens in new window PDF:123KB
Next-Generation Power Module for Automotive Applications - J1-Series Opens in new window PDF:314KB
Low On-Resistance SiC-MOSFET with a 3.3-kV Blocking Voltage Opens in new window PDF:385KB
Packaging Technologies for High-Temperature Power Semiconductor Modules Opens in new window PDF:184KB
Sep. 2013 Overview Opens in new window PDF:23KB
Development of SiC Power Devices – Present Status Opens in new window PDF:139KB
1.7kV Hybrid SiC Power Module with Large Current Capacity and Low Power Loss Opens in new window PDF:277KB
1,200 V HVIC Technology for Power Inverter System Opens in new window PDF:123KB
1200V/50A Large DIPIPM Ver. 4 Opens in new window PDF:180KB
The IGBT Module for Three-Level Bidirectional Switch Type Inverter Opens in new window PDF:103KB
"J-Series" IPM and T-PM for EV and HEV Applications Opens in new window PDF:88.6KB

Bodo's Power Systems

Publication Date Title PDF
May. 2019 The Next Generation of High Power IGBT Modules Opens in new windowPDF:727KB
Feb. 2019 Switching Performance of 750A/3300V Dual SiC-Modules Opens in new windowPDF:943KB
Jan. 2019 1700V X-Series HVIGBT Power Modules with Excellent Performance and Reliability Opens in new windowPDF:548KB
Dec. 2018 7th Generation NX type (NX7) Converter Inverter Brake (CIB) Modules Opens in new windowPDF:676KB
Sep. 2018 Gaining Speed: Mitsubishi Electric SiC-Power Modules Opens in new windowPDF:1,792KB
Jun. 2018 New Transfer Molded SMD Type IPM Opens in new windowPDF:289KB
Mar. 2018 7th Generation 1700 V IGBT Modules: Loss Reduction and Excellent System Performance Opens in new windowPDF:623KB
Jan. 2018 3.3 kV Full SiC MOSFETs – Towards High-Performance Traction Inverters Opens in new windowPDF:2,150KB
Dec. 2017 High Power Density,High Performance X-Series 4500V IGBT Power Modules Opens in new windowPDF:551KB
Oct. 2017 Advanced Si-IGBT Chip Design for Maximum Overall System Performance Opens in new windowPDF:1,377KB
May. 2017 New Horizons in Thermal Cycling Capability Realized with the 7th gen. IGBT Module Opens in new windowPDF:552KB
Nov. 2016 Innovative 7in1 IGBT Packages for Scalable and Easy Design of Industrial Drives and Inverters Opens in new windowPDF:600KB
Sep. 2016 All-In-One DIPIPM+ Series for Compact Inverter Designs Opens in new windowPDF:1,091KB
Apr. 2016 Power Modules for Combining Innovation Flexibility and Power Capability in the Various 3-Level Topologies Opens in new windowPDF:664KB
Jan. 2016 Transfer Mold IPM Family “SLIMDIP” with 5A/15A 600V RC (Reverse Conducting)– IGBT in a Compact Package Opens in new windowPDF:625KB
Feb. 2015 4in1 400A/1200V Module with T-type Topology for 3-Level Applications Opens in new windowPDF:484KB

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