Our pressure sensors are hybrids that combine a sensor section using the piezoresistance effect (application of stress changes the resistance ratio) and amplifier circuits integrated into one chip, with adjusting resistance added (Some sensors also have an ASIC).
The lineup includes acceleration sensors that pack a sensor chip, with a structure in which the electric capacity changes with inertia force, and a signal-processing ASIC into the same package, using bulk micromachining technology (a processing technology which forms a microscopic structure on the silicon single crystal board itself) that processes sensor chips with dry etching.
