Semiconductors & Devices

DIPIPMsDIPIPMs

Outline

DIPIPMTM (Dual Inline Package Intelligent Power Module) is a high performance IPM used primarily for consumer use inverters with the advance of next generations using mounted chips or transfer mold construction, products from Ver. 4 provide even smaller size by using high thermal conductivity insulation sheets.
Mounting a high voltage IC (HVIC) with a built-in high voltage level shift circuit enables direct input of an input signal from the microcontroller, without using a photo coupler. Further mounting a bootstrap circuit allows operation of an independent power supply for the IGBT drive of the upper arm (P side) of a 3-phase inverter connection.
In addition to our main product Version 6, we offer a lineup that includes SLIMDIPTM for consumer electronics, DIPIPM with built-in SJ-MOSFET, and the DIPIPM+TM for small industrial equipment.

Main Applications

Air conditioners/Washing machines/Refrigerator/AC servo/General-purpose Inverters /Small size motor control

Features of SLIMDIP series

  • RC-IGBT*1 having a FWD*2 built into an IGBT inside.
  • Extends maximum operational case temperature (Tc)*3 from 100°C to 115°C.
  • Reduces external size*3 by approximately 30% versus former products.
  • Analog signal output for IC temperature and over temperature protection install.
  • BSD*4 for P side drive power supply generation built in.
  • GND terminal for P side drive power supply built in.

  • *1 RC-IGBT: Reverse conducting IGBT
  • *2 FWD: Free Wheeling Diode
      A diode for commutating the load current
  • *3 In comparison to super mini DIPIPM series from our company.
  • *4 BSD: Bootstrap Diode
      A high withstanding diode for a bootstrap circuit that creates another voltage from the reference voltage.

  • Wiring example
SLIMDIP Wiring example

Features of DIPIPM with built-in SJ-MOSFET series

  • SJ-MOSFET (super junction MOSFET)*1 inside
  • Reduces ON voltage at low current by approximately 80% in comparison to IGBT*2.
  • In the same way as IGBT, assures electrification capability at high load.
  • External size and pin configuration are interchangeable with super mini packages from our company *3
  • Mounts a BSD*4 for P side drive power supply generation.
  • Supports air conditioners in 2.2kW~8.0kW capacity range.

  • *1 SJ-MOSFET: Super Junction Metal Oxide Semiconductor Field Effect Transistor
      A high withstanding insulated gate field effect transistor with lower loss than former
      MOSFET, for improving the trade-off between element withstanding and ON resistance.
  • *2 In comparison to super mini DIPIPM Ver. 6 (15A/600V)
  • *3 Super mini DIPIPM Ver. 6 series
  • *4 BSD: Bootstrap Diode
      A high withstanding diode for a bootstrap circuit that creates another voltage from the reference voltage.

  • Output characteristics (representative example)
Output characteristics

Features of DIPIPM+ series

  • Incorporates an inverter, 3-phase converter and brake circuit in a single package*1
  • Provides very small size by using direct wire bonding technology*2
  • Mounts short and control power supply voltage drop safeguard as well as analog temperature output function
  • Mounts a BSD*3 for P side drive power supply generation.
  • Inductance reduction allows decrease of passive components such as noise filters.

  • *1 CI (Converter-Inverter) wiring also available having no brake circuit with CIB
      (Converter-Inverter-Brake) wiring
  • *2 Original technology from our company bonds with direct wires between control IC and IGBT
  • *3 BSD: Bootstrap Diode
      A high withstanding diode for a bootstrap circuit that creates another voltage from the reference voltage.

  • Internal Components Block Diagram
Internal Components Block Diagram

Data Sheets

View data sheets for DIPIPMs