Skip to main content

Start main contents


Semiconductors & Devices

HVIGBT Modules/HVIPMHVIGBT Modules/HVIPM

Outline

This is a lineup of HV (High Voltage) IGBT modules that provide size reduction of the drive circuit, weight reduction of the system, and improved efficiency, allowing use in power electronics equipment, such as traction and large industrial machines which require high voltage and large current.
The lineup includes products having withstanding from 1.7kV to 6.5kV, contributing to high reliability as well as energy efficiency for large capacity inverter equipment.
In addition to the main H series, the new lineup includes the X series (7th generation IGBT), which further advances the R series in weight reduction with a high insulation package.
The X series has included new common frame package (LV100/HV100 type) in addition to the existing compatible package (standard type).

Main Applications

Inverter devices/converter devices/DC chopper devices

New Products
HVIGBT Module X-Series

Existing compatible package: Standard type
Contributes to smaller, higher-capacity inverter systems by expanding lineup

Existing compatible package: Standard type
  • Power loss reduced by incorporating 7th-generation IGBT and RFC*1 diode
  • Industry-leading power*2 for increased inverter capacity
  • The new chip set’s reduced package size, about 33% smaller than its predecessor (same voltage and current ratings), will lead to smaller inverters
  • Package’s new internal structure achieves longer lifetime through improved heat dissipation, moisture resistance and flame retardance
  • *1
    RFC : Relaxed field of cathode
  • *2
    3.3kV-6.5kV (as of Apr.5,2018 based on Mitsubishi Electric research)
  • *3
    Comparison of X Series 1200HC-66X and H Series CM1200HC-66H

New common frame package: LV100/HV100 type
Class-leading current density contributes to increased power output in inverter systems

New common frame package: LV100/HV100 type
  • Power loss reduced by incorporating 7th-generation IGBT and RFC*1 diode
  • Industry's highest 3.3kV/600A Si module power density of 8.57A/cm2*4 contributes to increased power output and efficiency
  • Terminal layout optimized for easy paralleling and flexible inverter configurations and capacities
  • New package structure offers extra reliability
  • *4
    As of Apr.5,2018, based on Mitsubishi Electric research

Positioning from conventional series(std. type)

Positioning from conventional series

Characteristics graph

Characteristics graph

Output current characteristics

Output current characteristics

Various current ratings for optimal system design(LV100 type)

Various current ratings for optimal system design

Package features (LV100 type)

Package features (LV100 type)

Data Sheets

View data sheets for HVIGBT Modules/HVIPM