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Semiconductors & Devices

MISOP(Surface-mount package IPM)MISOP(Surface-mount package IPM)

Outline

MISOP™ surface-mount package IPM (intelligent power module) that will facilitate the implementation of low cost inverter systems, thanks to its compact and easily soldered package design.

Main Applications

Small fan or pump for home appliances and industrial instruments

Features

MISOP
  • Optimal pin layout realizes easier PCB wiring design and enables smaller PCB size
  • Insulation distance between pins ensured, realizing easier board mounting without coating process
  • Integrate control ICs for IGBT gate drive circuit and protection functions equivalent to high power DIPIPM series And cross conduction prevention function(Interlock) is newly embedded
  • Thanks to integration of RC-IGBT*1s, MISOP can satisfy both of high efficient inverter operation and miniaturization of package size
  • Bootstrap diode (BSD) is integrated for the P-side drive power supply
  • *1
    Reverse-conducting IGBT
Type name Current rating Voltage rating Chips BSC Protection Shape
SP1SK 1A 600V RC-IGBT
HVIC
LVIC
BSD
UV
SC
OT
VOT
IL
Surface mount
package
SP1SL Embedded
SP3SK 3A
SP3SL Embedded
[Term]
UV:Power supply under-voltage protection
SC:Short-circuit protection
OT:Over Temperature protection
VOT:Analog Temperature Output
IL:Interlock
BSC:Bootstrap Capacitor

Schematic drawing

Schematic drawing

Schematic drawing

Schematic drawing