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Technology Now

Introducing Mitsubishi Electric Power Device Technologies and Product Trends

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1: Package Development

During the transition from discrete packages to case packages, Mitsubishi Electric introduced a module group based on the current universal package concept, the NX Series. These large-capacity, high insulation performance modules are utilized for applications like electrical railway equipment. Furthermore, applying semiconductor IC packaging technology, transfer molds like the DIPIPM™, which is mainly used in the development of consumer products, were developed and produced.

1-1: NX Series – Flexibility to respond to customer needs and improve cost performance

The package concept of the NX Series is said to be a next-generation case. Standardized basic components and flexible assembly processes enable flexible responses to customers' needs and improved cost performance. In order to meet diversified customer demands, basic components such as the case, base, pins, terminals and covers are standardized, while items like pin placement and main terminal positioning can be changed according to the assembly process.

New NX Series IGBT Module Package Concept

1-2: Evolution of IPM and DIPIPM™

In IPMs, the drive circuit is embedded in the IGBT, with the protection functions for heat, low-voltage control voltage and short-circuiting all integrated. The current L Series incorporates a gate adjustment circuit as a countermeasure for electromagnetic interference (EMI) noise, as well as other noise-reducing functions for each current bandwidth. DIPIPM™ transfer mold products are manufactured using an all-silicon IC fabrication method to realize improved production efficiency. The development of technologies to integrate functions for the control IC of DIPIPMs™ is currently underway.

DIPIPM Concept & Characteristics

DIPIPM™ packages were previously assembled by placing chips on lead frames and using resin molds. However, when using resin molds a certain level of thickness is required due to the heat dissipation and insulating characteristics of the resin, thereby causing the problem of low thermal resistance. Taking this into consideration, Mitsubishi Electric developed an insulation sheet that improves thermal resistance and maintains a high level of insulation, and introduced it beginning from the DIPIPM™ Ver. 4 Series. Adoption of the sheet also resulted in a considerable reduction in the size of the module. However, if size reduction is not a requirement and the demand is compatibility, the previous package size is capable of controlling a larger electrical current. Initially, a 600V/15A module called the "large type" was commercialized. However, ensuing improvements in thermal resistance and power loss enabled the rated current to be increased to 50A, and recently control of up to 75A has been realized.

One of the keys to attaining more electrical current using the same product (package size), or conversely, attaining a required electrical current in a smaller package/product, is technologies that enable system miniaturization and achieve high electrical current density.

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