Programmable Controllers MELSEC: Product list; Search by specification; Search products compliant with standards and certifications

FX5UC-64MT/DSS

Performance specifications

Control system
Input/output control system
No. of input/output points	(1) No. of input/output points
	(2) No. of remote I/O points
	Total No. of points of (1) and (2)
Programming specifications	Programming language
	Programming extension function
	Constant scan
	Fixed cycle interrupt
	Timer performance specifications
	No. of program executions
	No. of FB files
Operation specifications	Execution type
	Interrupt type
Command processing time	LD X0
	MOV D0 D1
Memory capacity	Program capacity
	SD memory card
	Device/label memory
	Data memory/standard ROM
Flash memory (Flash ROM) write count
File storage capacity	Device/label memory
	Data memory	P: No. of program files
		FB: No. of FB files
	SD memory card	2 Gbytes
		4 Gbytes, 8 Gbytes, 16 Gbytes
Clock function	Display data
	Precision
Power failure retention (clock data)	Retention method
	Retention time
Power failure retention (device)	Power failure retention capacity
Number of device points
No. of user device points	Input relay (X)	Octal
	Output relay (Y)	Octal
	Internal relay (M)	Decimal
	Latch relay (L)	Decimal
	Link relay (B)	Hexadecimal
	Annunciator (F)	Decimal
	Link special relay (SB)	Hexadecimal
	Step relay (S)	Decimal
	Timer system (Timer (T))	Decimal
	Accumulation timer system (Accumulation timer (ST))	Decimal
	Counter system (Counter (C))	Decimal
	Counter system (Long counter (LC))	Decimal
	Data register (D)	Decimal
	Link register (W)	Hexadecimal
	Link special register (SW)	Hexadecimal
No. of system device points	Special relay (SM)	Decimal
	Special register (SD)	Decimal
Module access device	Intelligent function module device	Decimal
No. of index register points	Index register (Z)	Decimal
	Long index register (LZ)	Decimal
No. of file register points	File register (R)	Decimal
	Extended file register (ER)	Decimal
No. of nesting points	Nesting (N)	Decimal
No. of pointer points	Pointer (P)	Decimal
	Interrupt pointer (I)	Decimal
Others	Decimal constant (K)	Signed
		Unsigned
	Hexadecimal constant (H)
	Real constant (E)	Single precision
	Character string
Power supply specifications
Power supply voltage
Voltage fluctuation range
Allowable instantaneous power failure time
Power fuse
Rush current
Power consumption
Capacity of 24 V DC power supply
Capacity of 5 V DC power supply
Input specifications
No. of input points
Input connection type
Input type
Input signal voltage
Input signal current	X0 to X17
	X20 and subsequent
Input impedance	X0 to X17
	X20 and subsequent
ON input sensitivity current	X0 to X17
	X20 and subsequent
OFF input sensitivity current
Input response frequency	X0 to X7
	X10 to X17
	X20 and subsequent
Pulse waveform
	X0 to X7
	X10 to X17
Input response time (H/W filter delay)	X0 to X7
	X10 to X17
	X20 and subsequent
Input response time (Digital filter setting value)
Input signal format (Input sensor form)
Input circuit insulation
Indication of input operation
Input circuit configuration
Output specifications
No. of output points
Output connection type
Output type
External power supply
Max. load	Y0 to Y3
	Y4 and subsequent
Open circuit leakage current
Voltage drop when ON	Y0 to Y3
	Y4 and subsequent
Response time	Y0 to Y3
	Y4 and subsequent
Output circuit insulation
Indication of output operation
Output circuit configuration

Stored-program repetitive operation

Refresh system
(Direct access input/output allowed by specification of direct access input/output [DX, DY])

256 points or less/384 points or less*
*Supported with CPU module firmware version 1.100 and later. In addition, GX Works3 version 1.047Z and later is required.

384 points or less/512 points or less*
*Supported with CPU module firmware version 1.100 and later. In addition, GX Works3 version 1.047Z and later is required.

512 points or less

Ladder diagram (LD), structured text (ST), function block diagram/ladder diagram (FBD/LD), sequential function chart (SFC)*
*For supported versions, refer to MELSEC iQ-F FX5 User's Manual (Application).

Function block (FB), function (FUN), label programming (local/global)

0.2 to 2000 ms (can be set in 0.1 ms increments)

1 to 60000 ms (can be set in 1 ms increments)

100 ms, 10 ms, 1 ms

16 (Up to 15 for user)

Standby type, initial execution type, scan execution type, fixed scan execution type, event execution type

Internal timer interrupt, input interruption, high-speed comparison match interrupt, interrupt by modules*
*Interrupt from the intelligent function module and high-speed pulse input/output module.

34 ns*
*When the program capacity is 64 k steps.

64 k steps/128 k steps* (128 kbytes/256 kbytes, flash memory)
*Supported with CPU module firmware version 1.100 or later. In addition, GX Works3 version 1.047Z or later is required.

Memory card capacity (SD/SDHC memory card: Max. 16 Gbytes)

120 kbytes

5 Mbytes

Maximum 20000 times

511
The number of files stored in the root folder.

65534
The number of files stored in the root folder.

Year, month, day, hour, minute, second, day of week (leap year automatic detection)

Differences per month ±45 sec./25℃ (TYP)

Large-capacity capacitor
Clock data is retained using the power accumulated in a large-capacity capacitor incorporated into the PLC. When voltage of the large-capacity capacitor drops, clock data is no longer accurately retained. The retention period of a fully charged capacitor (electricity is conducted across the PLC for at least 30 minutes) is 10 days (ambient temperature: 25℃). How long the capacitor can hold the data depends on the operating ambient temperature. When the operating ambient temperature is high, the holding period is short.

10 days (Ambient temperature: 25℃)

Maximum 12 k word
It is possible to back up all devices in device (high-speed) area. When a battery is used, it is also possible to back up devices in device (standard) area.

1024 points
The total number of X and Y assigned to I/O points is up to 256 points/384 points*
*Supported with CPU module firmware version 1.100 or later. In addition, GX Works3 version 1.047Z or later is required.

32768 points (can be changed with parameter)
Can be changed with parameters within the capacity range of the CPU built-in memory.

4096 points (fixed)

1024 points (can be changed with parameter)
Can be changed with parameters within the capacity range of the CPU built-in memory.

8000 points (can be changed with parameter)
Can be changed with parameters within the capacity range of the CPU built-in memory.

32768 points (can be changed with parameter)
Can be changed with parameters within the capacity range of the CPU built-in memory.

10000 points (fixed)

12000 points (fixed)

65536 points (designated by U□\G□)

24 points
The sum of index register (Z) and long index register (LZ) is 24 words.

12 points
The sum of index register (Z) and long index register (LZ) is 24 words.

32768 points (can be changed with parameter)
Can be changed with parameters within the capacity range of the CPU built-in memory.

32768 points (are stored in SD memory card)

15 points (fixed)

4096 points

178 points (fixed)

16 bits: -32768 to +32767
32 bits: -2147483648 to +2147483647

16 bits: 0 to 65535
32 bits: 0 to 4294967295

16 bits: 0 to FFFF
32 bits: 0 to FFFFFFFF

E-3.40282347+38 to E-1.17549435-38, 0, E1.17549435-38 to E3.40282347+38

Shift-JIS code max. 255 single-byte characters (256 including NULL)

24 V DC

+20%, -15%

Operation can be continued upon occurrence of instantaneous power failure for 5 ms or less.

125 V, 3.15 A Time-lag fuse

40 A max. 0.5 ms or less/24 V DC

8 W/24 V DC [33 W/24 V DC +20%, -15%]
This item shows value when only the CPU module is used.
The value in [] is the value in the maximum configuration connectable to the CPU module. (The value does not include the external 24 V DC power supply of extension devices)

500 mA

720 mA

32 points

Connector

Sink/source

24 V DC +20%, -15%

5.3 mA/24 V DC

4.0 mA/24 V DC

4.3 kΩ

5.6 kΩ

3.5 mA or more

3.0 mA or more

1.5 mA or less

200 kHz
When capturing pulses of a response frequency of 50 to 200 kHz, refer to MELSEC iQ-F FX5S/FX5UJ/FX5U/FX5UC User's Manual (Hardware).

10 kHz

0.1±0.05 kHz

T1 (pulse width): 2.5 μs or more
T2 (rise/fall time): 1.25 μs or less

T1 (pulse width): 50 μs or more
T2 (rise/fall time): 25 μs or less

ON: 2.5 μs or less
OFF: 2.5 μs or less

ON: 30 μs or less
OFF: 50 μs or less

ON: 50 μs or less
OFF: 150 μs or less

None, 10 μs, 50 μs, 0.1 ms, 0.2 ms, 0.4 ms, 0.6 ms, 1 ms, 5 ms, 10 ms (initial values), 20 ms, 70 ms
When using this product in an environment with much noise, set the digital filter.

No-voltage contact input
Sink: NPN open collector transistor
Source: PNP open collector transistor

Photo-coupler insulation

LED is lit when input is on (DISP switch: IN)

32 points

Connector

Transistor/source output

5-30 V DC

0.3 A/point
The total load current per common terminal should be the following value.
8 output points/common terminal: 0.8 A or less
(When two common terminals are connected outside the CPU module, resistance load is 1.6 A or less.)

0.1 A/point
The total load current per common terminal should be the following value.
8 output points/common terminal: 0.8 A or less
(When two common terminals are connected outside the CPU module, resistance load is 1.6 A or less.)

0.1 mA or less/30 V DC

1.0 V or less

1.5 V or less

2.5 μs or less/10 mA or more (5-24 V DC)

0.2 ms or less/100 mA (24 V DC)

Photo-coupler insulation

LED is lit when output is on (DISP switch: OUT)

Function specifications

Firmware update function
Scan monitoring function (Watchdog timer setting)
Clock function
Online change	Online ladder block change
Interrupt function	Multiple interrupt function
PID control function
Constant scan
Remote operation	Remote RUN/STOP
	Remote PAUSE
	Remote RESET
Device/label memory area setting
Program capacity setting
Internal buffer capacity setting
Initial device value setting
Latch function
Memory card function	SD memory card forced stop
	Boot operation
Device/label access service processing setting
Data logging function
Memory dump function
Real-time monitor function
RAS function	Self-diagnostics function
	Error clear
	Event history function
Data backup/restoration function
Security function
IP filter function
High-speed input/output function	High-speed counter function
	Pulse width measurement function
	Input interrupt function
	Positioning function
	PWM output function
Built-in Ethernet function
CC-Link IE Field Network Basic function
Serial communication function
MODBUS communication function

This function updates the module's firmware using an SD memory card.

Detects an error in the hardware and program of the CPU module by monitoring the scan time.

This function is used for the time management in the function which the system operates such as the date of the event history function, and data logging function.

Writes the part of a program edited on the ladder editor using the engineering tool to the CPU module in units of ladder blocks. Edited contents spanning multiple portions can be written to the CPU module at once.

When an interrupt occurs while an interrupt program triggered by another cause is running, stops the program if its priority is lower than that of the new interrupt, and runs the higher-priority program whenever its execution condition is satisfied.

Performs PID control by the PID control instruction.

Keeps the scan time constant and executes program repeatedly.

Changes the CPU module status to the RUN/STOP/PAUSE status externally while the RUN/STOP/RESET switch of the CPU module is in RUN status.

Resets the CPU module externally while the CPU module is in the STOP status.

Sets the capacity of each area in the device/label memory.

Set to change program capacity.

Sets the capacity of the area (internal buffer) used by the system to temporarily store the results of data logging and memory dump processing.

Sets the initial values of devices used in the program directly (not via the program) to the devices.

Holds the contents of the device and label of the CPU module when the power is turned ON etc.

Makes the SD memory card unavailable without turning OFF the power even when the function accessing the SD memory card is executed.

Transfers the file stored in the SD memory card to the transfer destination memory judged automatically by the CPU module when the power is turned ON or is reset.

Sets the number of execution times of the device/label access service processing executed by END processing, with parameter.

Collects data at the specified interval or any desired timing, and stores them as a file on the SD memory card.

Saves the data in the devices of the CPU module at a desired timing.

Monitors the data in the specified device of the CPU module at a specified interval or at a desired timing in real time.

Self-diagnoses the CPU module to see whether an error exist or not.

Batch-clears all the continuation errors being detected.

Collects operations executed and errors detected from the modules, and saves them in the CPU module, expansion adapter, and intelligent module. The saved logs can be checked in chronological order.

Backs up program files, parameter files, and device/label data files in a CPU module to an SD memory card. The backup data can be restored as needed.

Protects resources stored in PCs and resources in the units in the system of the FX5 from illegal access by a third party such as theft, alteration, accidental operation and unauthorized execution.

Identifies the IP address of external devices over Ethernet, and blocks access from an invalid IP address.

Performs high-speed counter, pulse width measurement, input interruption, etc. by using the input of the CPU module or high-speed pulse input/output module.

Executes positioning operation by using the transistor output of the CPU module or high-speed pulse input/output module.

Executes a PWM output by using the transistor output of the CPU module or high-speed pulse input/output module.

An Ethernet related function such as connection to MELSOFT products and GOTs, socket communication, file transfer using FTP, Web server (HTTP), SNTP client, and simple CPU communication function.

This function exchanges data between the master station and remote station using general-purpose Ethernet.

A function related to the serial communication such as N:N Network, parallel link, MC protocol, inverter communication function and non-protocol communication.

Connection with the products which support MODBUS RTU/TCP is available. The master and slave functions can be used.

General specifications

Operating ambient temperature
Storage ambient temperature
Operating ambient humidity
Storage ambient humidity
Vibration resistance	Installed on DIN rail	Frequency: 5 to 8.4 Hz
		Frequency: 8.4 to 150 Hz
Shock resistance
Noise durability
Dielectric withstand voltage	Between power supply terminal (24 V DC) and ground terminal
	Between input terminal (24 V DC) and ground terminal
	Between output terminal (transistor) and ground terminal
Insulation resistance	Between power supply terminal (24 V DC) and ground terminal
	Between input terminal (24 V DC) and ground terminal
	Between output terminal (transistor) and ground terminal
Grounding
Working atmosphere
Operating altitude
Installation location
Overvoltage category
Pollution degree

-20 to 55℃, non-freezing
The simultaneous ON ratio of available PLC inputs or outputs changes with respect to the ambient temperature, refer to MELSEC iQ-F FX5S/FX5UJ/FX5U/FX5UC User's Manual (Hardware).
The operating ambient temperature is 0 to 55℃ for products manufactured before June 2016. For details on Intelligent function modules, refer to manuals of each product.
In the case where operating ambient temperature is lower than 0℃, the specifications are different from the above description. For details, refer to MELSEC iQ-F FX5S/FX5UJ/FX5U/FX5UC User's Manual (Hardware).

-25 to 75℃, non-freezing

5 to 95%RH, non-condensation
When used in a low-temperature environment, use in an environment with no sudden temperature changes. If there are sudden temperature changes because of opening/closing of the control panel or other reasons, condensation may occur, which may cause a fire, fault, or malfunction. Furthermore, use an air conditioner in dehumidifier mode to prevent condensation.

5 to 95%RH, non-condensation

Half amplitude: 1.75 mm 10 times each in X, Y, Z directions (80 min in each direction)
The criterion is shown in IEC61131-2.

Acceleration: 4.9 m/s² 10 times each in X, Y, Z directions (80 min in each direction)
The criterion is shown in IEC61131-2.

147 m/s², Action time: 11 ms, 3 times by half-sine pulse in each direction X, Y, and Z
The criterion is shown in IEC61131-2.

By noise simulator at noise voltage of 1000 Vp-p, noise width of 1 μs and period of 30 to 100 Hz

500 V AC for one minute

10 MΩ or higher by 500 V DC insulation resistance tester

Class D grounding (grounding resistance: 100 Ω or less)
(Common grounding with a heavy electrical system is not allowed)
For grounding, refer to MELSEC iQ-F FX5S/FX5UJ/FX5U/FX5UC User's Manual (Hardware).

Free from corrosive or flammable gas and excessive conductive dust

0 to 2000 m
The PLC cannot be used at a pressure higher than the atmospheric pressure to avoid damage.

Inside a control panel
The programmable controller is assumed to be installed in an environment equivalent to indoor.

II or less
This indicates the section of the power supply to which the equipment is assumed to be connected between the public electrical power distribution network and the machinery within premises. Category II applies to equipment for which electrical power is supplied from fixed facilities. The surge voltage withstand level for up to the rated voltage of 300 V is 2500 V.

2 or less
This index indicates the degree to which conductive material is generated in the environment in which the equipment is used. Pollution level 2 is when only non-conductive pollution occurs. Temporary conductivity caused by condensation must be expected occasionally.

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