Factory Automation

Programmable Controllers MELSEC Feature -Selection Guide-

MELSEC Selection Guide

Controller lineup

Series Modular type Modular type Baseless type

MELSEC iQ-R

MELSEC-Q

MELSEC-L
PAC (Programmable automation controller) Programmable controller CPU Programmable controller CPU
Lineup •Programmable controller CPU
•CC-Link IE embedded CPU
•Safety CPU
•Process CPU*1
•SIL2 Process CPU
•C Controller
•MELSECWinCPU
•Motion CPU
•Robot CPU
•CNC CPU
•Programmable controller CPU
(Universal model)
•Process CPU
(Universal model)
•C Controller
•Motion CPU
•Robot controller
•CNC CPU
•Programmable controller CPU
 Sink type
 Source type
Control method Stored program cyclic operation Stored program cyclic operation Stored program cyclic operation
I/O control mode Refresh mode Refresh mode Refresh mode
Programming language •Ladder diagram
•Structured text (ST)
•Sequential function chart (SFC)*2
•Function block diagram (FBD/LD)
•Function block (FB)
•C/C++*3
•Ladder diagram
•Structured text (ST)
•Instruction list
•MELSAP3 (SFC), MELSAP-L
•Function block diagram (FBD)
•Function block (FB)
•C/C++*3
•Ladder diagram
•Structured text (ST)
•Instruction list
•MELSAP3 (SFC), MELSAP-L
•Function block (FB)
Engineering environment MELSOFT GX Works3
MELSOFT MT Works2
CW Workbench
MELSOFT GX Works2
MELSOFT PX Developer
MELSOFT MT Works2
CW Workbench
MELSOFT GX Works2
Program size (K step) 1200 1000 260
Number of I/O points (X/Y) (point) 4096 4096 4096
Device/label memory/ standard RAM (K byte) 3380 1792 768
Data memory/standard ROM (byte) 40M 16M 2M
Processing speed
LD instruction (ns) 0.98 1.9 9.5
MOV instruction (ns) 1.96 3.9 19
Floating point addition (µs) 0.01 0.014 0.057
Memory interface
Extended SRAM cassette *4
SD memory card *4 *5
SRAM card, FLASH card, ATA card *6
External interface
USB
Ethernet
 (1000BASE-T*7/
  100BASE-TX/
  10BASE-T)
*8 *5
RS-232 *9 *10 *11
RS-422/485
Display unit
CC-Link IE connection port
Ethernet
 (1000BASE-T/
  100BASE-TX/
  10BASE-T)
*12
Network connectivity (adapter/module)
Ethernet
 (1000BASE-T*13/
  100BASE-TX/
  10BASE-T)
CC-Link IE TSN
CC-Link IE Control
CC-Link IE Field *14
CC-Link
SSCNETⅢ/H
AnyWire
BACnet®
MODBUS®/TCP
MODBUS®
General specifications
Operating ambient temperature 0...55℃ (60℃*15) 0...55℃ 0...55℃
Key features/functions •Line manufacturing
•Distributed control
•Small-scale I/O control
•Large-scale I/O control
•Security
•Inter-modular sync
•Built-in database
•Integrated network
•Multiple CPU
•Process control
•High-reliability control
•C programming
•Datalogging
•IT gateway
•Advanced motion
•Safety
•Real-time monitor
•Line manufacturing
•Distributed control
•Large-scale I/O control
•Integrated network
•Multiple CPU
•Process control
•C programming
•Data logging
•IT gateway
•Advanced motion
•Machine control
•Distributed control
•Small-scale I/O control
•Large-scale I/O control
•Space/cost saving
•Integrated network
•Extensive built-in functions
•Data logging
•Motion control
•Real-time monitor
Series Compact type Compact type
MELSEC iQ-F
MELSEC iQ-F
写真:MELSEC-F
MELSEC-F
Programmable controller CPU Programmable controller CPU
FX5UJ FX5U/FX5UC FX3S FX3G/FX3GC FX3U/FX3UC
Lineup •FX5UJ (screw terminal block type) •FX5U (screw terminal block type)
•FX5UC (connector type)
•FX5UC (spring clamp terminal block type)
•FX3S •FX3G
•FX3GC
•FX3U
•FX3UC
Control method Stored program cyclic operatio Stored program cyclic operatio
I/O control mode Refresh mode Refresh mode
Programming language •Ladder diagram
•Structured text (ST)
•Function block diagram (FBD/LD)
•Function block (FB)
•Ladder diagram
•Structured text (ST)
•Function block diagram (FBD/LD)
•Function block (FB)
•Sequential function chart (SFC)
•Ladder diagram
•Structured text (ST)
•Function block diagram (FBD/LD)
•Function block (FB)
•Sequential function chart (SFC)
Engineering environment MELSOFT GX Works3 MELSOFT GX Works2
Program size
(K step)
48 64/128 4 32 64
Number of I/O points [X/Y] (point) 256 384 30 128 256
Device/label memory/ standard RAM (K byte) 120 150
Data memory/ standard ROM (byte) 5M 5M
Processing speed
LD instruction (ns) 34 34*16 210 210 65
MOV instruction (ns) 34 34*16 520 520 640
Floating point addition (µs) 3.967 3.692 11.96 11.96 14.2
Memory interface
Extended SRAM cassette *17
SD memory card
SRAM card, FLASH card,
ATA card
External interface
USB
Ethernet
 (1000BASE-T*7/
  100BASE-TX/
  10BASE-T)
RS-232
RS-422/485
Display unit *17
CC-Link IE connection port
Ethernet
 (1000BASE-T/
  100BASE-TX/
  10BASE-T)
Network connectivity (adapter/module)
Ethernet
 (1000BASE-T*13/
  100BASE-TX/
  10BASE-T)
CC-Link IE TSN
CC-Link IE Control
CC-Link IE Field
CC-Link
SSCNETⅢ/H *18
AnyWire
BACnet®
MODBUS®/TCP
MODBUS®
General specifications
Operating ambient temperature 0...55℃ −0...55℃*19 0...55℃ 0...55℃ 0...55℃
Key features/functions •Machine control
•Distributed control
•Small-scale I/O control
•Space/cost saving
•Security
•Integrated network
•Extensive built-in functions
•Data logging
•Motion contro
•Machine control
•Small-scale I/O control
•Space/cost saving
•Motion control
  • *1.Supports redundant system when paired with R6RFM
  • *2.SFC is not supported in redundant mode and by safety CPU
  • *3.When using CW Workbench
  • *4.Q□UDVCPU only.
  • *5.Does not support L02SCPU(-P)
  • *6.Does not support QnUDVCPU and certain models
  • *7.Supports the user Ethernet port of Q24DHCCPU-V/VG/LS and Q26DHCCPU-LS only
  • *8.Supports Q□UDE(H)CPU and Q□UDVCPU only
  • *9.Supports C Controller and MELSECWinCPU only
  • *10.Does not support Q□UDE(H)CPU and Q□UDVCPU
  • *11.Supports L02SCPU(-P) only
  • *12.R□ENCPU only
  • *13.Supports the MELSEC iQ-R Series only.
  • *14.Does not support Q□(P)(H)CPU and Q□PRHCPU
  • *15.Only supported when used together with extended temperature range main/extension base units
  • *16.When the program capacity is 64K steps
  • *17.Supports FX3G only
  • *18.Supports SSCNETⅢ
  • *19.Operating ambient temperature from -20℃ is supported by products produced from June 2016 (serial number "166" or later). For details, on supported products, please refer to the relevant product manual.