FOR IMMEDIATE RELEASE No. 3186
TOKYO, April 16, 2018 - Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it would launch a MISOPTM (Mitsubishi Electric Intelligent Small Outline Power Module) surface-mount package intelligent power module (IPM) that will facilitate the implementation of low cost inverter systems, thanks to its compact and easily soldered package design. Featuring a well-arranged pin layout, integrated driver ICs and protection circuits, the new MISOP is expected to lead to inverter systems with smaller and simpler designed printed circuit board (PCB). In addition, PCB mounting using reflow soldering will allow easier and lower-cost assembly compared to products requiring through-hole mounting. It will be launched on September 1.
Mitsubishi Electric's new MISOP will be exhibited at major trade shows, including MOTOR TECH JAPAN 2018 during TECHNO-FROTIER 2018 in Makuhari, Japan from April 18 to 20, PCIM Europe 2018 in Nuremberg, Germany from June 5 to 7, and PCIM Asia 2018 in Shanghai, China from June 26 to 28.
MISOP surface-mount package IPM
In line with increasing global measures for environmental protection and energy savings, inverter systems are even being incorporated in small fan motors, including the indoor and outdoor units of air conditioning systems. Mitsubishi Electric's new MISOP surface-mount package IPM is designed for such inverter systems, which must use low-power semiconductor modules and be easy to assemble.