• Semiconductors & Devices


TOKYO, May 7, 2019 - Mitsubishi Electric Corporation (TOKYO: 6503)announced today the launch of three new Large DIPIPM+TM transfer-mold intelligent power modules featuring loading-converter circuits that realize simpler and more compact designs for use in air-conditioner and industrial inverters. Of special note, one of the new modules achieves a world's first* high-density output of 100A/1200V in its transfer-mold package. Sales of the new DIPIPM+ series will begin on May 29. Also, the modules will be exhibited at major trade shows, including Power Conversion Intelligent Motion (PCIM) Europe 2019 in Nuremberg, Germany from May 7 to 9 and PCIM-Asia 2019 in Shanghai, China from June 26 to 28.

  1. *According to Mitsubishi Electric research as of May 7, 2019

Mitsubishi Electric has been contributing to the miniaturization and energy-efficiency of inverter systems since commercializing its first DIPIPMTM series in 1997. The more compact and simpler-design DIPIPM+ series, which places the inverter and converter into one package, was introduced in 2015. In response to increasing demands for high-power compressors in package air conditioners, the company is now adding models of up to 100A/1200V for package (heat & cooling) air conditioners in the 56kW class.

New Large DIPIPM+ series

New Large DIPIPM+ series

Sales Schedule

Product Model Specification Release date
PSS50NE1CT 50A / 1200V May 29, 2019
PSS75NE1CT 75A / 1200V
PSS100NE1CT 100A / 1200V

Product Features

  1. 1)World's leading high-density output in transfer-mold package
    • PSS100NE1CT achieves a world's first high-density output of 100A/1200V in its transfer-mold package, suitable for 56kW class package air conditioners.
    • 100A/1200V model's small package and large capacity realized through Mitsubishi Electric's proprietary direct-wire-bonding technology
    • Built-in analog temperature voltage output and protection functions
  2. 2)Downsizing and simpler design for inverter systems
    • Built-in inverter, converter and drive circuits enable inverter systems with fewer external components
    • Simpler wiring pattern on board helps to downsize inverter systems


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