Technical Reports
Power Devices Technical Reports
High frequency & Optical Devices Technical Reports
Power Devices Technical Reports
Mitsubishi Electric ADVANCE
Publication Date | Title | |
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Mar. 2019 | Overview | ![]() |
RC-IGBT Chip Technology for White Goods | ||
Development of Package Structure for High-Temperature Operation | ||
Packaging Technologies Using Epoxy Resin Sealing | ||
Relaxing Thermal Stress by Using SLC Technology and New PC-TIM | ||
Optimized inverter design by DIPIPM+ | ||
Sep. 2016 | Overview | ![]() |
7th Generation Power Chip Technologies for Industrial Application | ||
Packaging Technology for Highly Reliable Industrial Power Modules | ||
7th Generation IGBT Module "T Series" for Industrial Applications | ||
7th Generation IPM "G1 Series" for Industrial Applications | ||
All-in-One Type DIPIPM with Built-In Converter, Inveter and Brake | ||
Mar. 2015 | Overview | ![]() |
Super Mini DIPIPM "Ver.6 Series" | ||
Hybrid SiC Modules for High-Frequency Applications | ||
Next-Generation Power Module for Automotive Applications - J1-Series | ||
Low On-Resistance SiC-MOSFET with a 3.3-kV Blocking Voltage | ||
Packaging Technologies for High-Temperature Power Semiconductor Modules | ||
Sep. 2013 | Overview | ![]() |
Development of SiC Power Devices – Present Status | ||
1.7kV Hybrid SiC Power Module with Large Current Capacity and Low Power Loss | ||
1,200 V HVIC Technology for Power Inverter System | ||
1200V/50A Large DIPIPM Ver. 4 | ||
The IGBT Module for Three-Level Bidirectional Switch Type Inverter | ||
"J-Series" IPM and T-PM for EV and HEV Applications |
Bodo's Power Systems
Publication Date | Title | |
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Sep. 2022 | LV100 IGBT Modules for Best Performance in Renewable and Industrial Applications | ![]() |
Sep. 2021 | High-Voltage IGBT Modules for High-Power High-Reliability Applications | ![]() |
Jul. 2021 | Demands by Future Railway Converters and How They Change Power Semiconductor Modules | ![]() |
Apr. 2021 | Small Power IPM for High Integration Demand | ![]() |
Dec. 2020 | Towards a Greener Future: Highly Efficient SiC Power Devices for Wide Application Range |
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Oct. 2020 | LV100: Smart Solution for 1500VDC 3-Level Central PV Inverters | ![]() |
May. 2020 | X-Series RFC Diodes for Robust and Reliable Medium-Voltage Drives | ![]() |
Apr. 2020 | An Intelligent Power Module for High Switching Speeds | ![]() |
Nov. 2019 | Robust High Voltage IGBT Power Modules Against Humidity and Condensation | ![]() |
Oct. 2019 | The Intelligent Power Module Concept for Motor Drive Inverters | ![]() |
May. 2019 | The Next Generation of High Power IGBT Modules | ![]() |
Feb. 2019 | Switching Performance of 750A/3300V Dual SiC-Modules | ![]() |
Jan. 2019 | 1700V X-Series HVIGBT Power Modules with Excellent Performance and Reliability | ![]() |
Dec. 2018 | 7th Generation NX type (NX7) Converter Inverter Brake (CIB) Modules | ![]() |
Sep. 2018 | Gaining Speed: Mitsubishi Electric SiC-Power Modules | ![]() |
Jun. 2018 | New Transfer Molded SMD Type IPM | ![]() |
Mar. 2018 | 7th Generation 1700 V IGBT Modules: Loss Reduction and Excellent System Performance | ![]() |
Jan. 2018 | 3.3 kV Full SiC MOSFETs – Towards High-Performance Traction Inverters | ![]() |
Dec. 2017 | High Power Density,High Performance X-Series 4500V IGBT Power Modules | ![]() |
Oct. 2017 | Advanced Si-IGBT Chip Design for Maximum Overall System Performance | ![]() |
May. 2017 | New Horizons in Thermal Cycling Capability Realized with the 7th gen. IGBT Module | ![]() |
Nov. 2016 | Innovative 7in1 IGBT Packages for Scalable and Easy Design of Industrial Drives and Inverters | ![]() |
Sep. 2016 | All-In-One DIPIPM+ Series for Compact Inverter Designs | ![]() |
Apr. 2016 | Power Modules for Combining Innovation Flexibility and Power Capability in the Various 3-Level Topologies | ![]() |
Jan. 2016 | Transfer Mold IPM Family “SLIMDIP” with 5A/15A 600V RC (Reverse Conducting)– IGBT in a Compact Package | ![]() |
Oct. 2015 | Highest Power Density by 7th Gen. IGBT Std-Type Module with New TMS-Technology | ![]() |
Jun. 2015 | 7th Gen. IGBT and Diode Chipset Enabling Highest Performance Power Modules | ![]() |
Feb. 2015 | 4in1 400A/1200V Module with T-type Topology for 3-Level Applications | ![]() |
High frequency & Optical Devices Technical Reports
Mitsubishi Electric ADVANCE
Publication Date | Title |
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March 2022 Vol.177 | High-Frequency and Optical Devices![]() |
December 2019 Vol.168 | High-Frequency & Optical Devices![]() |
March 2018 Vol.161 | Optical & High-Frequency Devices![]() |
March 2016 Vol.153 | Recent Advances in Optical and Microwave Devices![]() |