Technical Reports
Power Devices Technical Reports
High frequency & Optical Devices Technical Reports
Power Devices Technical Reports
Mitsubishi Electric ADVANCE
| Publication Date | Title | |
|---|---|---|
| Mar. 2019 | Overview |  PDF: 1,509KB |
| RC-IGBT Chip Technology for White Goods | ||
| Development of Package Structure for High-Temperature Operation | ||
| Packaging Technologies Using Epoxy Resin Sealing | ||
| Relaxing Thermal Stress by Using SLC Technology and New PC-TIM | ||
| Optimized inverter design by DIPIPM+ | ||
| Sep. 2016 | Overview | PDF: 1,641KB |
| 7th Generation Power Chip Technologies for Industrial Application | ||
| Packaging Technology for Highly Reliable Industrial Power Modules | ||
| 7th Generation IGBT Module "T Series" for Industrial Applications | ||
| 7th Generation IPM "G1 Series" for Industrial Applications | ||
| All-in-One Type DIPIPM with Built-In Converter, Inveter and Brake | ||
| Mar. 2015 | Overview | PDF: 1,650KB |
| Super Mini DIPIPM "Ver.6 Series" | ||
| Hybrid SiC Modules for High-Frequency Applications | ||
| Next-Generation Power Module for Automotive Applications - J1-Series | ||
| Low On-Resistance SiC-MOSFET with a 3.3-kV Blocking Voltage | ||
| Packaging Technologies for High-Temperature Power Semiconductor Modules | ||
| Sep. 2013 | Overview | PDF: 949KB |
| Development of SiC Power Devices – Present Status | ||
| 1.7kV Hybrid SiC Power Module with Large Current Capacity and Low Power Loss | ||
| 1,200 V HVIC Technology for Power Inverter System | ||
| 1200V/50A Large DIPIPM Ver. 4 | ||
| The IGBT Module for Three-Level Bidirectional Switch Type Inverter | ||
| "J-Series" IPM and T-PM for EV and HEV Applications |
Bodo's Power Systems
| Publication Date | Title | |
|---|---|---|
| Sep. 2022 | LV100 IGBT Modules for Best Performance in Renewable and Industrial Applications | PDF: 7,821KB |
| Sep. 2021 | High-Voltage IGBT Modules for High-Power High-Reliability Applications | PDF: 5,307KB |
| Jul. 2021 | Demands by Future Railway Converters and How They Change Power Semiconductor Modules | PDF: 917KB |
| Apr. 2021 | Small Power IPM for High Integration Demand | PDF: 865KB |
| Dec. 2020 | Towards a Greener Future: Highly Efficient SiC Power Devices for Wide Application Range |
PDF: 1,790KB |
| Oct. 2020 | LV100: Smart Solution for 1500VDC 3-Level Central PV Inverters | PDF: 1,841KB |
| May. 2020 | X-Series RFC Diodes for Robust and Reliable Medium-Voltage Drives | PDF: 2,966KB |
| Apr. 2020 | An Intelligent Power Module for High Switching Speeds | PDF: 1,945KB |
| Nov. 2019 | Robust High Voltage IGBT Power Modules Against Humidity and Condensation | PDF: 1,063KB |
| Oct. 2019 | The Intelligent Power Module Concept for Motor Drive Inverters | PDF: 444KB |
| May. 2019 | The Next Generation of High Power IGBT Modules | PDF: 727KB |
| Feb. 2019 | Switching Performance of 750A/3300V Dual SiC-Modules | PDF: 943KB |
| Jan. 2019 | 1700V X-Series HVIGBT Power Modules with Excellent Performance and Reliability | PDF: 548KB |
| Dec. 2018 | 7th Generation NX type (NX7) Converter Inverter Brake (CIB) Modules | PDF: 676KB |
| Sep. 2018 | Gaining Speed: Mitsubishi Electric SiC-Power Modules | PDF: 1,792KB |
| Jun. 2018 | New Transfer Molded SMD Type IPM | PDF: 289KB |
| Mar. 2018 | 7th Generation 1700 V IGBT Modules: Loss Reduction and Excellent System Performance | PDF: 623KB |
| Jan. 2018 | 3.3 kV Full SiC MOSFETs – Towards High-Performance Traction Inverters | PDF: 2,150KB |
| Dec. 2017 | High Power Density,High Performance X-Series 4500V IGBT Power Modules | PDF: 551KB |
| Oct. 2017 | Advanced Si-IGBT Chip Design for Maximum Overall System Performance | PDF: 1,377KB |
| May. 2017 | New Horizons in Thermal Cycling Capability Realized with the 7th gen. IGBT Module | PDF: 552KB |
| Nov. 2016 | Innovative 7in1 IGBT Packages for Scalable and Easy Design of Industrial Drives and Inverters | PDF: 600KB |
| Sep. 2016 | All-In-One DIPIPM+ Series for Compact Inverter Designs | PDF: 1,091KB |
| Apr. 2016 | Power Modules for Combining Innovation Flexibility and Power Capability in the Various 3-Level Topologies | PDF: 664KB |
| Jan. 2016 | Transfer Mold IPM Family “SLIMDIP” with 5A/15A 600V RC (Reverse Conducting)– IGBT in a Compact Package | PDF: 625KB |
| Oct. 2015 | Highest Power Density by 7th Gen. IGBT Std-Type Module with New TMS-Technology | PDF: 693KB |
| Jun. 2015 | 7th Gen. IGBT and Diode Chipset Enabling Highest Performance Power Modules | PDF: 601KB |
| Feb. 2015 | 4in1 400A/1200V Module with T-type Topology for 3-Level Applications | PDF: 484KB |
High frequency & Optical Devices Technical Reports
Mitsubishi Electric ADVANCE
| Publication Date | Title |
|---|---|
| March 2022 Vol.177 | High-Frequency and Optical Devices |
| December 2019 Vol.168 | High-Frequency & Optical Devices |
| March 2018 Vol.161 | Optical & High-Frequency Devices |
| March 2016 Vol.153 | Recent Advances in Optical and Microwave Devices |
