Power Devices Technical Reports
Mitsubishi Electric ADVANCE
Bodo's Power Systems
High frequency & Optical Devices Technical Reports
Mitsubishi Electric ADVANCE
Mitsubishi Electric ADVANCE
| Publication Date |
Title |
PDF |
| Mar. 2019 |
Overview |
 PDF: 1,509KB |
| RC-IGBT Chip Technology for White Goods |
| Development of Package Structure for High-Temperature Operation |
| Packaging Technologies Using Epoxy Resin Sealing |
| Relaxing Thermal Stress by Using SLC Technology and New PC-TIM |
| Optimized inverter design by DIPIPM+ |
| Sep. 2016 |
Overview |
PDF: 1,641KB |
| 7th Generation Power Chip Technologies for Industrial Application |
| Packaging Technology for Highly Reliable Industrial Power Modules |
| 7th Generation IGBT Module "T Series" for Industrial Applications |
| 7th Generation IPM "G1 Series" for Industrial Applications |
| All-in-One Type DIPIPM with Built-In Converter, Inveter and Brake |
| Mar. 2015 |
Overview |
PDF: 1,650KB |
| Super Mini DIPIPM "Ver.6 Series" |
| Hybrid SiC Modules for High-Frequency Applications |
| Next-Generation Power Module for Automotive Applications - J1-Series |
| Low On-Resistance SiC-MOSFET with a 3.3-kV Blocking Voltage |
| Packaging Technologies for High-Temperature Power Semiconductor Modules |
| Sep. 2013 |
Overview |
PDF: 949KB |
| Development of SiC Power Devices – Present Status |
| 1.7kV Hybrid SiC Power Module with Large Current Capacity and Low Power Loss |
| 1,200 V HVIC Technology for Power Inverter System |
| 1200V/50A Large DIPIPM Ver. 4 |
| The IGBT Module for Three-Level Bidirectional Switch Type Inverter |
| "J-Series" IPM and T-PM for EV and HEV Applications |
Bodo's Power Systems
| Publication Date |
Title |
PDF |
| Nov. 2019 |
Robust High Voltage IGBT Power Modules Against Humidity and Condensation |
PDF: 1,063KB |
| Oct. 2019 |
The Intelligent Power Module Concept for Motor Drive Inverters |
PDF: 444KB |
| May. 2019 |
The Next Generation of High Power IGBT Modules |
PDF: 727KB |
| Feb. 2019 |
Switching Performance of 750A/3300V Dual SiC-Modules |
PDF: 943KB |
| Jan. 2019 |
1700V X-Series HVIGBT Power Modules with Excellent Performance and Reliability |
PDF: 548KB |
| Dec. 2018 |
7th Generation NX type (NX7) Converter Inverter Brake (CIB) Modules |
PDF: 676KB |
| Sep. 2018 |
Gaining Speed: Mitsubishi Electric SiC-Power Modules |
PDF: 1,792KB |
| Jun. 2018 |
New Transfer Molded SMD Type IPM |
PDF: 289KB |
| Mar. 2018 |
7th Generation 1700 V IGBT Modules: Loss Reduction and Excellent System Performance |
PDF: 623KB |
| Jan. 2018 |
3.3 kV Full SiC MOSFETs – Towards High-Performance Traction Inverters |
PDF: 2,150KB |
| Dec. 2017 |
High Power Density,High Performance X-Series 4500V IGBT Power Modules |
PDF: 551KB |
| Oct. 2017 |
Advanced Si-IGBT Chip Design for Maximum Overall System Performance |
PDF: 1,377KB |
| May. 2017 |
New Horizons in Thermal Cycling Capability Realized with the 7th gen. IGBT Module |
PDF: 552KB |
| Nov. 2016 |
Innovative 7in1 IGBT Packages for Scalable and Easy Design of Industrial Drives and Inverters |
PDF: 600KB |
| Sep. 2016 |
All-In-One DIPIPM+ Series for Compact Inverter Designs |
PDF: 1,091KB |
| Apr. 2016 |
Power Modules for Combining Innovation Flexibility and Power Capability in the Various 3-Level Topologies |
PDF: 664KB |
| Jan. 2016 |
Transfer Mold IPM Family “SLIMDIP” with 5A/15A 600V RC (Reverse Conducting)– IGBT in a Compact Package |
PDF: 625KB |
| Oct. 2015 |
Highest Power Density by 7th Gen. IGBT Std-Type Module with New TMS-Technology |
PDF: 693KB |
| Jun. 2015 |
7th Gen. IGBT and Diode Chipset Enabling Highest Performance Power Modules |
PDF: 601KB |
| Feb. 2015 |
4in1 400A/1200V Module with T-type Topology for 3-Level Applications |
PDF: 484KB |
Mitsubishi Electric ADVANCE
Technical Reports
