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Semiconductors & Devices

Technical ReportsTechnical Reports

Power Devices Technical Reports

High frequency & Optical Devices Technical Reports

Power Devices Technical Reports

Mitsubishi Electric ADVANCE

Publication Date Title PDF
Mar. 2019 Overview Opens in new windowPDF: 1,509KB
RC-IGBT Chip Technology for White Goods
Development of Package Structure for High-Temperature Operation
Packaging Technologies Using Epoxy Resin Sealing
Relaxing Thermal Stress by Using SLC Technology and New PC-TIM
Optimized inverter design by DIPIPM+
Sep. 2016 Overview Opens in new windowPDF: 1,641KB
7th Generation Power Chip Technologies for Industrial Application
Packaging Technology for Highly Reliable Industrial Power Modules
7th Generation IGBT Module "T Series" for Industrial Applications
7th Generation IPM "G1 Series" for Industrial Applications
All-in-One Type DIPIPM with Built-In Converter, Inveter and Brake
Mar. 2015 Overview Opens in new windowPDF: 1,650KB
Super Mini DIPIPM "Ver.6 Series"
Hybrid SiC Modules for High-Frequency Applications
Next-Generation Power Module for Automotive Applications - J1-Series
Low On-Resistance SiC-MOSFET with a 3.3-kV Blocking Voltage
Packaging Technologies for High-Temperature Power Semiconductor Modules
Sep. 2013 Overview Opens in new windowPDF: 949KB
Development of SiC Power Devices – Present Status
1.7kV Hybrid SiC Power Module with Large Current Capacity and Low Power Loss
1,200 V HVIC Technology for Power Inverter System
1200V/50A Large DIPIPM Ver. 4
The IGBT Module for Three-Level Bidirectional Switch Type Inverter
"J-Series" IPM and T-PM for EV and HEV Applications

Bodo's Power Systems

Publication Date Title PDF
Nov. 2019 Robust High Voltage IGBT Power Modules Against Humidity and Condensation Opens in new windowPDF: 1,063KB
Oct. 2019 The Intelligent Power Module Concept for Motor Drive Inverters Opens in new windowPDF: 444KB
May. 2019 The Next Generation of High Power IGBT Modules Opens in new windowPDF: 727KB
Feb. 2019 Switching Performance of 750A/3300V Dual SiC-Modules Opens in new windowPDF: 943KB
Jan. 2019 1700V X-Series HVIGBT Power Modules with Excellent Performance and Reliability Opens in new windowPDF: 548KB
Dec. 2018 7th Generation NX type (NX7) Converter Inverter Brake (CIB) Modules Opens in new windowPDF: 676KB
Sep. 2018 Gaining Speed: Mitsubishi Electric SiC-Power Modules Opens in new windowPDF: 1,792KB
Jun. 2018 New Transfer Molded SMD Type IPM Opens in new windowPDF: 289KB
Mar. 2018 7th Generation 1700 V IGBT Modules: Loss Reduction and Excellent System Performance Opens in new windowPDF: 623KB
Jan. 2018 3.3 kV Full SiC MOSFETs – Towards High-Performance Traction Inverters Opens in new windowPDF: 2,150KB
Dec. 2017 High Power Density,High Performance X-Series 4500V IGBT Power Modules Opens in new windowPDF: 551KB
Oct. 2017 Advanced Si-IGBT Chip Design for Maximum Overall System Performance Opens in new windowPDF: 1,377KB
May. 2017 New Horizons in Thermal Cycling Capability Realized with the 7th gen. IGBT Module Opens in new windowPDF: 552KB
Nov. 2016 Innovative 7in1 IGBT Packages for Scalable and Easy Design of Industrial Drives and Inverters Opens in new windowPDF: 600KB
Sep. 2016 All-In-One DIPIPM+ Series for Compact Inverter Designs Opens in new windowPDF: 1,091KB
Apr. 2016 Power Modules for Combining Innovation Flexibility and Power Capability in the Various 3-Level Topologies Opens in new windowPDF: 664KB
Jan. 2016 Transfer Mold IPM Family “SLIMDIP” with 5A/15A 600V RC (Reverse Conducting)– IGBT in a Compact Package Opens in new windowPDF: 625KB
Oct. 2015 Highest Power Density by 7th Gen. IGBT Std-Type Module with New TMS-Technology Opens in new windowPDF: 693KB
Jun. 2015 7th Gen. IGBT and Diode Chipset Enabling Highest Performance Power Modules Opens in new windowPDF: 601KB
Feb. 2015 4in1 400A/1200V Module with T-type Topology for 3-Level Applications Opens in new windowPDF: 484KB

High frequency & Optical Devices Technical Reports

Mitsubishi Electric ADVANCE

Publication Date Title
December 2019 Vol.168 High-Frequency & Optical DevicesOpens in new window
March 2018 Vol.161/td> Optical & High-Frequency DevicesOpens in new window
March 2016 Vol.153 Recent Advances in Optical and Microwave DevicesOpens in new window