Technical Reports
Mitsubishi Electric ADVANCE
| Publication Date | Title | |
|---|---|---|
| Sep. 2024 | Overview | |
| Power Module for Automotive "J3 Series" | ||
| SLIMDIP Series Lineup Expansion and Future Prospects | ||
| Improvement of Surge Current Capability of High Voltage SBD-embedded SiC MOSFET Module | ||
| Trench SiC-MOSFET Structure for Controlling Short-Circuit Capability | ||
| Sep. 2022 | Overview | |
| SiC Power Module for Automotive | ||
| TH-Series: 7th Generation IGBT Modules for High-frequency Switching in Industrial Operation | ||
| The Investigation of Humidity Absorption Behavior of Silicone Gel in HVIGBT Modules | ||
| Built-in BSD-Function 600V High Voltage Integrated Circuit "M81777FP" | ||
| Development of SiC Trench MOSFET with Novel Structure Enabling Lower Losses | ||
| Dec. 2020 | Overview | |
| Development of SiC-MOSFET Chip Technology | ||
| Development of Wiring Technologes to Improve Power Module Performance | ||
| 2000 V Class IGBT Concept for Renewable Energy Converter | ||
| Humidity Robustness Verification Test for HVIGBT Modules | ||
| Development of Surface-mount IPM | ||
| Mar. 2019 | Overview | |
| RC-IGBT Chip Technology for White Goods | ||
| Development of Package Structure for High-Temperature Operation | ||
| Packaging Technologies Using Epoxy Resin Sealing | ||
| Relaxing Thermal Stress by Using SLC Technology and New PC-TIM | ||
| Optimized inverter design by DIPIPM+ | ||
| Sep. 2016 | Overview | |
| 7th Generation Power Chip Technologies for Industrial Application | ||
| Packaging Technology for Highly Reliable Industrial Power Modules | ||
| 7th Generation IGBT Module "T Series" for Industrial Applications | ||
| 7th Generation IPM "G1 Series" for Industrial Applications | ||
| All-in-One Type DIPIPM with Built-In Converter, Inveter and Brake | ||
| Mar. 2015 | Overview | |
| Super Mini DIPIPM "Ver.6 Series | ||
| Hybrid SiC Modules for High-Frequency Applications | ||
| Next-Generation Power Module for Automotive Applications - J1-Series | ||
| Low On-Resistance SiC-MOSFET with a 3.3-kV Blocking Voltage | ||
| Packaging Technologies for High-Temperature Power Semiconductor Modules | ||
| Sep. 2013 | Overview | |
| Development of SiC Power Devices – Present Status | ||
| 1.7kV Hybrid SiC Power Module with Large Current Capacity and Low Power Loss | ||
| 1,200 V HVIC Technology for Power Inverter System | ||
| 1200V/50A Large DIPIPM Ver. 4 | ||
| The IGBT Module for Three-Level Bidirectional Switch Type Inverter | ||
| J-Series" IPM and T-PM for EV and HEV Applications |
Bodo's Power Systems （英文）
| Publication Date | Title | |
|---|---|---|
| Sep. 2025 | Next-Gen SiC MOSFET & Si RC-IGBT: Bare-Dies and Transfer Mold Power Modules | |
| Aug. 2025 | HV-IGBT Module for High- Performance Inverter Design | |
| Mar. 2025 | Enhancing xEV Powertrains: J3-Series SiC Modules Redefine Efficiency and Compactness with Advanced Trench Technology | |
| Dec. 2024 | Mega-Watt-Level Power Stack Design with LV100 Package | |
| Oct. 2024 | 2.5 kV IGBT Module in LV100 Package with Enhanced SLC+ Technology for Superior Power Cycling Performance | |
| Sep. 2024 | How a Unifull™ SiC Power Module Reduces Carbon Emissions in the Transportation Sector | |
| Aug. 2024 | Powering the Future: 8th Generation Si IGBT Chips in Innovative LV100 Packages | |
| Mar. 2024 | Transition to SiC MOSFETs while maintaining the established NX Package Outline | |
| Sep. 2023 | The DIPIPM Family: Our Technology, Your Comfort | |
| Jul. 2023 | Increasing Power Density of 4.5 kV IGBT Power Modules | |
| Feb.2023 | Parallel Operation: Influence of Power Module Parameters | |
| Sep. 2022 | LV100 IGBT Modules for Best Performance in Renewable and Industrial Applications | |
| Sep. 2021 | High-Voltage IGBT Modules for High-Power High-Reliability Applications | |
| Jul. 2021 | Demands by Future Railway Converters and How They Change Power Semiconductor Modules | |
| Apr. 2021 | Small Power IPM for High Integration Demand | |
| Dec. 2020 | Towards a Greener Future: Highly Efficient SiC Power Devices for Wide Application Range | |
| Oct. 2020 | LV100: Smart Solution for 1500VDC 3-Level Central PV Inverters | |
| May. 2020 | X-Series RFC Diodes for Robust and Reliable Medium-Voltage Drives | |
| Apr. 2020 | An Intelligent Power Module for High Switching Speeds | |
| Nov. 2019 | Robust High Voltage IGBT Power Modules Against Humidity and Condensation | |
| Oct. 2019 | The Intelligent Power Module Concept for Motor Drive Inverters | |
| May. 2019 | The Next Generation of High Power IGBT Modules | |
| Feb. 2019 | Switching Performance of 750A/3300V Dual SiC-Modules | |
| Jan. 2019 | 1700V X-Series HVIGBT Power Modules with Excellent Performance and Reliability | |
| Dec. 2018 | 7th Generation NX type (NX7) Converter Inverter Brake (CIB) Modules | |
| Sep. 2018 | Gaining Speed: Mitsubishi Electric SiC-Power Modules | |
| Jun. 2018 | New Transfer Molded SMD Type IPM | |
| Mar. 2018 | 7th Generation 1700 V IGBT Modules: Loss Reduction and Excellent System Performance | |
| Jan. 2018 | 3.3 kV Full SiC MOSFETs – Towards High-Performance Traction Inverters | |
| Dec. 2017 | High Power Density,High Performance X-Series 4500V IGBT Power Modules | |
| Oct. 2017 | Advanced Si-IGBT Chip Design for Maximum Overall System Performance | |
| May. 2017 | New Horizons in Thermal Cycling Capability Realized with the 7th gen. IGBT Module | |
| Nov. 2016 | Innovative 7in1 IGBT Packages for Scalable and Easy Design of Industrial Drives and Inverters | |
| Sep. 2016 | All-In-One DIPIPM+ Series for Compact Inverter Designs | |
| Apr. 2016 | Power Modules for Combining Innovation Flexibility and Power Capability in the Various 3-Level Topologies | |
| Jan. 2016 | Transfer Mold IPM Family “SLIMDIP” with 5A/15A 600V RC (Reverse Conducting)– IGBT in a Compact Package | |
| Oct. 2015 | Highest Power Density by 7th Gen. IGBT Std-Type Module with New TMS-Technology | |
| Jun. 2015 | 7th Gen. IGBT and Diode Chipset Enabling Highest Performance Power Modules | |
| Feb. 2015 | 4in1 400A/1200V Module with T-type Topology for 3-Level Applications |