Infrared Sensors
Outline
This infrared sensor incorporates thermal-diode infrared sensor technologies originally developed by Mitsubishi Electric to realize higher pixel and high-temperature resolution performance. By capturing the advanced temperature detection of people objects, etc. which is hard to obtained by Passive Infrared Ray (PIR) sensors, and improving the performance of identifying people/objects and people‘s movements. This sensor is ideal for crime prevention, surveillance systems, people-counting systems, and air-conditioning systems, and other equipment for control temperature with temperature measurement, without using an expensive infrared cameras.
Mitsubishi Electric also offers "User-support tools" including application proposal documentation, product evaluation kits, reference codes, reference designs and other items to support the development of customers' products.
Infrared sensor introduction video (Mitsubishi Electric Channel in YouTube)
CatalogNew Products
80x60-pixel Thermal-diode infrared sensor "MelDIR"
Capable of measuring temperatures up to 200°C MIR8060B3
- Capable of much higher temperature measurements range to 200°C than conventional thermal sensors, responding to market needs such as monitoring kitchens and factory equipment, etc.
- User support tools that help users to shorten product-development time
MIR8060B3
Products line up
| MIR8060 series | MIR8032 series | ||
|---|---|---|---|
| Type No. | MIR8060B3★★ | MIR8060B1 | MIR8032B1 |
| Temp. resolution (NETD) | 400 mK (Typ.) | 100 mK (Typ.) | 100 mK (Typ.) |
| FOV | 78° × 53° (Typ.) | 78° × 29° (Typ.) | |
| Frame rate | 4 / 8 fps (selective) | 4 fps (fixed) | |
| Operating voltage | 3.3 V | 3.3 V | |
| Current consumption | 50mA (Max.) | 50mA (Max.) | |
| Product dimensions | 19.5 × 13.5 × 9.5 mm | 19.5 × 13.5 × 9.5 mm | |
| Detectable temp. range | -5 ～ +200 °C | -5 ～ +60 °C | -5 ～ +60 °C |
| Interface | Serial Peripheral Interface (SPI) | Serial Peripheral Interface (SPI) | |
| Pixels | 80 × 60 pixels |
80 × 32 pixels |
|
- ★★
: Development
Features
High pixel count and high temperature-resolution enable highly precise understanding of people/object movement
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Mitsubishi Electric Original Pixel Structure
- The supporting legs are ultrathin by an innovative semiconductor microfabrication technique
- Mounting the thermal diode and high-performance amplifier on the same chip
Vacuum-sealing, Chip-scale Packaging Contributes to Compact Space-saving Size
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Vacuum-sealing, Chip-scale technology
- Chip-scale packaging technology developed in-house
- New packaging technology reduces product size to approx. 80% compared to conventional products*
- *Compared to general 16x16 pixel thermopiles available in market.
Main Applications
- *This cannot be used for medical diagnosis.
Thermal image examples for each application
- *This cannot be used for medical diagnosis.
Examples of use by Mitsubishi Electric
- *We plan to use utilize the information acquired by the infrared sensor MelDIR in future functions.
- These products or solutions are only provided in Japan
User-support tools
User-support tools that contribute to reducing customer development time
- Provided item
Data Sheets
View data sheets for Infrared Sensors
