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Semiconductors & Devices

IGBT ModulesIGBT Modules

Outline

IGBT (Insulated Gate Bipolar Transistor) module is a device required for inverter use in many types of industrial equipment, and had driven the trend towards high currents and high voltage since 1990.
The chip structure also evolved from a flat planar structure to a trench gate structure, and the CSTBT™ (Mitsubishi Electric's unique IGBT that makes use of the carrier cumulative effect) has enabled low loss and smaller size for industrial equipment.
From the 5th generation IGBT, the lineup has included composite products*1 with a thin profile (NX type) in addition to the former external shape (standard type).
From the S series (6th generation IGBT), there has been additionally offered the T/T1 series (7th generation IGBT), with low power loss and smaller size.

  • *1
    Incorporates an inverter, 3-phase converter and brake circuit in a single package

Series, Main Application

Series Main Application
T Motion control / Renewable energy / Power supply
T1
For 3-level Inverters
S
S1
A
NF
NF(NFH type)

Rated Lineup

Rated Lineup

New Products
IGBT module T-series (LV100 for industrial)

IGBT module T-series (LV100 for industrial)
  • Next generation high capacity standard package for industrial use
  • Improved ease of use by applying low impedance package
  • Reducing the switching loss and optimal for the applications that are used in 1 to 5KHz
  • Isolation voltage 4kV

Product lineup

800A/1700V, 800A/1700V(with enhanced FWD), 1200A/1700V
800A/1200V, 1200A/1200V 2in1 type (Under development)

Internal circuit diagram

Internal circuit diagram

Featured Products
T/T1-Series

T/T1-Series
  • New modules equipped with three-phase converter, inverter, and brake circuit(CIB), contributes to simplifying design for inverter systems
  • CIB modules contribute to compact inverter systems by reducing package size by 36% compared to the Mitsubishi Electric's existing module.(CIB)
  • Power loss has been reduced with the introduction of the 7th-generation IGBT produced using CSTBT™*2 and a diode incorporating a relaxed field of cathode (RFC) structure
  • The new structure introduced eliminates the solder-attached section, increasing the thermal cycle lifetime, which contributes to improving the reliability of inverters
  • The introduction of press-fit pins and PC-TIM*1 contribute to simplifying the assembly process for inverters
  • *1
    PC-TIM:Phase change - thermal interface material
  • *2
    CSTBT™: Mitsubishi Electric’s unique IGBT that makes use of the carrier cumulative effect

New structure realizes improved reliability(improved thermal cycle lifetime)

IGBT module, T series (CIB) internal circuit diagram

Press-fit terminal support(NX)

  • Possible to select the control pin shape(soldered terminals/press-fit terminals)
  • Solder attachment process eliminated
Comparison of external size of IGBT module (CIB)

Data Sheets

View data sheets for IGBT Modules