MISOP™ surface-mount package IPM (intelligent power module) that will facilitate the implementation of low cost inverter systems, thanks to its compact and easily soldered package design.
MISOP(Surface-mount package IPM)
Outline
Main Applications
Small fan or pump for home appliances and industrial instruments
Features
- Optimal pin layout realizes easier PCB wiring design and enables smaller PCB size
- Insulation distance between pins ensured, realizing easier board mounting without coating process
- Integrate control ICs for IGBT gate drive circuit and protection functions equivalent to high power DIPIPM series And cross conduction prevention function(Interlock) is newly embedded
- Thanks to integration of RC-IGBT*1s, MISOP can satisfy both of high efficient inverter operation and miniaturization of package size
- Bootstrap diode (BSD) is integrated for the P-side drive power supply
- *1Reverse-conducting IGBT
| Type name | Current rating | Voltage rating | Chips | Protection | Shape |
|---|---|---|---|---|---|
| SP2SK | 2A | 600V | RC-IGBT HVIC LVIC BSD |
UV SC OT VOT IL |
Surface mount package |
| SP3SK | 3A |
- *Data sheet will be uploaded
- *We decided to add 2A product(SP2SK) to the lineup and remove the original SP1SK from the series.
- [Term]
-
UV: Power supply under-voltage protection SC: Short-circuit protection OT: Over Temperature protection VOT: Analog Temperature Output IL: Interlock
