Semiconductor & Device Business
Leading Social Change through Semiconductor Evolution and Innovation
The semiconductor & device business comprises the power device business and the high-frequency & optical device business.
SiC/Si Power Semiconductors: Reducing the Power Consumption of Customer Devices
Full SiC SLIMDIP and Hybrid SiC SLIMDIP: Power Semiconductor Modules for Home Appliances such as Room Air Conditioners
In our power device business, we are committed to advancing technologies for efficient power and motor control. By continuously improving performance and quality, we contribute to energy savings in power electronics and support the realization of a decarbonized society. The DIPIPM, commercialized in 1997, is an intelligent power semiconductor module with a transfer-molded structure that integrates switching elements and control ICs for driving and protection. The SLIMDIP series, launched in 2015, incorporates RC-IGBT,*1 achieving approximately 30% size reduction*2 compared to previous models. It has contributed to both energy efficiency and compact design in home appliances such as room air conditioners and washing machines. Now, for the first time in the SLIMDIP series, we have adopted SiC*3 MOSFET,*4 enabling higher output and significant reduction in power loss—approximately 79% with Full SiC SLIMDIP and 47% with Hybrid SiC SLIMDIP*5 compared to conventional modules. This advancement further promotes low power consumption.
- 1 Reverse Conducting IGBT with one IGBT and one diode on a single chip
- 2 Compared to the Super Mini DIPIPM Ver.6 package
- 3 Silicon carbide
- 4 Metal-Oxide-Semiconductor Field-Effect Transistor
- 5 Comparison with conventional SLIMDIP-L under conditions: Vcc = 300V, fc = 5kHz, PF = 0.8, M = 1, fo = 60Hz, three-phase modulation
Full SiC SLIMDIP and Hybrid SiC SLIMDIP: Power Semiconductor Modules for Home Appliances
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Optical Communication Devices: Contributing to High-speed Communication in Data Centers
200Gbps EML chip and 200Gbps PIN-PD chip for next-generation data centers
In our high-frequency & optical device business, we apply our core competence—compound semiconductor technology—to application fields such as information and communications and sensing. By creating new value that meets the needs of the times, we contribute to the realization of a safe, secure lifestyle and a comfortable digital society. The recent surge in data traffic—driven by high-resolution video streaming and the growing adoption of generative AI technologies—has created an unprecedented demand for higher-speed networks. As optical devices for use in optical transceivers*1 that support next-generation transmission speeds of 800Gbps*2 and 1.6Tbps,*3 our optical device business for data centers began mass production of the 200Gbps EML*4 chip for optical transmission in April 2024 and initiated sample shipments of the 200Gbps pin-PD*5 chip for optical reception in October 2024. These chips will contribute to the expansion of communication capacity of optical transceivers and the enhancement of speed and capacity in data center communications.
- 1 An electronic component that converts electrical signals into optical signals and back again
- 2 Giga-bits per second: A transmission speed that sends 1 billion digital signals per second.
- 3 Tera-bits per second: A transmission speed that sends 1 trillion digital signals per second.
- 4 Electro-absorption Modulator integrated Laser diode: A semiconductor laser diode that integrated with an electro-absorption optical modulator.
- 5 A photodiode with a PIN junction
200Gbps EML chip and 200Gbps pin-PD chip for next-generation data centers(Front/Back View)
- All photographs and illustrations are conceptual images.
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