J1 Series

Automotive Direct Cooling Power Module

Extra-compact, direct-cooling 6-in-1 package with cooling fin.
Inverter power-loss reduction and high reliability supported by 7th-generation IGBT chip applied CSTBTTM※1 technology.
※1:CSTBTTM is Mitsubishi Electric’s original IGBT chip construction incorporating carrier-store effect.


  • Low power loss 7th-generation IGBT chip applied CSTBTTM technology.
  • High reliability DLB※2 structure
  • 6-switching elements per package (6-in-1, insulated type)
    Direct cooling package with cooling fin
  • Compact, light-weight, high-power-density module
  • Built-in on-chip temperature sensor
  • Built-in on-chip current sensor for SC protection
  • ※2:Direct Lead Bonding


  • EV・HEV
  • High reliability inverter


VCES (V) IC (A) Type Name
650 600
650* 700

700A product has an optional specification with an insert nut embedded in the board mounting boss.

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