J1 Series
Automotive Direct Cooling Power Module
Extra-compact, direct-cooling 6-in-1 package with cooling fin.
Inverter power-loss reduction and high reliability supported by 7th-generation IGBT chip applied CSTBTTM※1 technology.
※1：CSTBTTM is Mitsubishi Electric’s original IGBT chip construction incorporating carrier-store effect.
Features
- Low power loss 7th-generation IGBT chip applied CSTBTTM technology.
- High reliability DLB※2 structure
- 6-switching elements per package (6-in-1, insulated type)
Direct cooling package with cooling fin - Compact, light-weight, high-power-density module
- Built-in on-chip temperature sensor
- Built-in on-chip current sensor for SC protection
- ※2：Direct Lead Bonding
Applications
- EV・HEV
- High reliability inverter
Lineup
| VCES (V) | IC (A) | 形名 |
|---|---|---|
| 650 | 600 | |
| 650* | 700 |
700A製品には基板取付ボス部にインサートナットを埋め込んだオプション仕様があります
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Documents
Corresponding Products
Automotive SiC/Si Module
J3-series
With its compact size and extensive product lineup, it can be used with a wide range of xEVs, helping to extend driving range and improve power consumption.
SiC-MOSFET / RC-IGBT Bare Die
Planar and trench type SiC MOSFET technology and third generation RC-IGBT technology contribute to low power loss and high reliability.
Links to associated page
Power Loss Simulation Software
Calculate average power loss and temperature rise for Mitsubishi Electric power modules.
FAQ