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Insights. SV-P Series Die-Sinking EDM Machine: Semiconductor Package Option. The challenges faced when Mitsubishi Electric EDMs entered the semiconductor industry. Part 3. Helping to revitalize an industry

The development team did not hesitate

“It looks good! Yes, this will be OK.”
In June 2022, the third technical roundtable took place. Equipped with the power supply system developed by Hikosaka and the axis control system developed by Nakagawa, the die-sinking EDM finally succeeded in producing the semiconductor encapsulation molds that met the criteria set by CAPABLE.

The new power supply, with a redesigned circuit and higher energy discharge, was a success.

Gaining the approval of CAPABLE was a major step forward in the development of the die-sinking EDM targeted at producing semiconductor encapsulation molds. Mitsubishi Electric decided to market the new solution as an optional semiconductor package for the SV-P Series die-sinking EDM, initially releasing the prototype in November 2022. When setting the detailed specifications, one particularly important element was the extent to which surface roughness should be covered.

“Let’s do this right, even if it means delaying the release”

Yoshiki Adachi joined the development team around the time the mold sample was approved by CAPABLE. He was responsible for talking to potential users, including CAPABLE, to determine the specifications for the EDM machine. As expected, one of the key points was surface roughness. Adachi needed to determine the needs of users to work out the range of roughness settings that should be provided.

The required roughness depends on the size and mounting format of the semiconductor, so the EDM machine would need to support several settings to cover the needs of all users. The development team had initially planned to provide between two and four levels of roughness, but after consulting with potential customers, Adachi realized this would not be enough.
There was a greater demand for finer levels of roughness than the development team had anticipated.

Generally, the processing machine did not actually have to provide all levels of roughness from the start. In theory it would be possible to prepare only the minimum number of options and leave it up to the engineers on the user’s side to make the final adjustments, but this would rely on the skills of the engineers. However, because CAPABLE’s business model depends on guaranteeing the quality of molds produced by subcontractors, they wanted all of the required roughness levels to be preset as parameters in the machine, rather than relying on on-site adjustment.

Adachi approached the development team with his findings and proposed expanding the range of surface roughness covered by the machine. He suggested that they should provide six or seven levels of roughness. Nakagawa and the rest of the development team were convinced by Adachi arguments; but it was difficult to implement the proposal immediately because it would involve revising the development plan, which was based on the target release date of November 2022, that had already been authorized by the company’s executives. If Adachi’s proposal was to be accepted, the whole schedule would have to be rewritten.

But the development team did not hesitate.
Mitsubishi Electric was already a latecomer to the semiconductor market. If they didn’t incorporate every anticipated requirement, there would be no hope of surpassing the competitors that were already established in the market. Delaying the release date was a minor matter if it meant gaining a long-term competitive advantage.

In January 2023, it was officially decided to delay the product release until summer 2023, with the intention of expanding the range of surface roughness options. Some stakeholders were unhappy about the delay, but the team insisted on pursuing functions unique to Mitsubishi Electric.

A pipe full of holes was the solution

Expanding the range of surface roughness was one step towards the overall goal of producing a die-sinking EDM that did not rely on engineers making on-site adjustments. However, the Mitsubishi Electric team now faced another challenge: how to control the processing fluid.

In the EDM process, if debris from machining is not removed properly, secondary electrical discharges can affect the remaining debris particles and result in damage to the machined surface. Normally, when using an EDM machine, workpieces are immersed in a tank, and the machined debris is washed away by spraying processing fluid from a nozzle. The position and angle of this nozzle must be manually adjusted for each workpiece. If the nozzle is improperly adjusted, it may cause defects because debris is not completely washed away.

The solution to this issue was surprisingly simple: a pipe with holes. By pumping the processing fluid through this perforated pipe, using the holes like a shower, the team found that they could create a flow in the tank that was sufficient to wash away the machining debris.
“I didn’t think the issue could be solved simply by making holes in a pipe,” said Sasaki.

photo:The perforated pipe is installed

The perforated pipe is installed at the back of the tank. Processing fluid is sprayed through the holes, creating a flow in the tank to remove any machining debris

Mitsubishi Electric’s serious attitude wins over the industry

The goal: A machine that can produce high-quality semiconductor encapsulation molds without relying on the technical skill of the manufacturer. As Mitsubishi Electric moved closer to making this concept a reality, one potential user began to show great interest: it was none other than CAPABLE, the company that had refused to even test the initial sample.

In December 2022, Shotaro Osono, who oversees EDM sales and marketing at Mitsubishi Electric, heard from CAPABLE about their plans to open a training center for engineers from mold manufacturers, and that they wanted to use the die-sinking EDM machine with its semiconductor package, currently under development at Mitsubishi Electric, at this training center. It was only 18 months since the initial sample was “turned away at the door”, and less than six months since CAPABLE had finally accepted the third sample. Osono was astounded by how rapidly the situation had developed.

Mitsubishi Electric’s relationship with CAPABLE grew increasingly strong, and in February 2023, the two companies gave a joint lecture at a seminar hosted by the Japan Die & Mold Industry Association. Mold manufacturers see CAPABLE as a powerful presence, forging a new future for Japan’s molding industry. The fact that Mitsubishi Electric presented jointly with CAPABLE had a huge impact within the industry. After the lecture, many companies expressed an interest in entering semiconductor mold manufacturing.

photo:Seminar held jointly with CAPABLE

Seminar held jointly with CAPABLE: “Trends in the semiconductor industry and Mitsubishi Electric's EDM machines” (photo shows President Kawahara of CAPABLE speaking at the seminar)

The reason CAPABLE became so positive towards Mitsubishi Electric’s EDM machine was because they saw how seriously Mitsubishi Electric went about the development process. Yoichi Kawahara, President of CAPABLE, said,
“Mitsubishi Electric was a total latecomer to the semiconductor sector, we assumed they had no interest in semiconductor manufacturing, I was surprised that they could make exactly what we wanted in under two years.”

When President Kawahara said, “what we wanted”, he meant a system allowing mold manufacturers to produce high-quality semiconductor encapsulation molds without relying on the skill level of the engineers. If a manufacturer is highly proficient in using die-sinking EDM machines, they would be able to start manufacturing semiconductor encapsulation molds on their own without support from CAPABLE. But the reality is that not many Japanese manufacturers have this level of skill. CAPABLE’s objective is to increase the number of partners who can produce the molds that semiconductor manufacturers want and raise the level of Japan’s molding industry at the same time. Mitsubishi Electric’s processing machines, which can handle any surface roughness and mold shape simply by setting preset parameters, match CAPABLE’s vision perfectly.

Yoichi Kawahara

President, CAPABLE Corporation

Born in Osaka Prefecture. After graduation he joined Marubeni Corporation, serving as manager of the Electronics Devices Department and IT Division, and external director for ten companies. Joined TOWA Corporation in 2003, becoming President & COO in 2006. Lead TOWA Corporation’s reconstruction and revitalization program, as well as the development of the semiconductor encapsulation business for automotive applications.
Founded CAPABLE Corporation in 2012 and remains its President and CEO until the present day.

Keeping the back-end process in Japan

CAPABLE’s training center was completed in November 2023. Two SV12P EDM units equipped with semiconductor packages – products that Mitsubishi Electric had only started shipping the previous month – were installed at the new training center, to help educate engineers from CAPABLE’s partners. Adachi and his team had responsibility for instructing the CAPABLE engineers who would then be training the partners.

“As more engineers are trained at the center, preset processing machines like ours will take a leading role,” commented Osono, who was responsible for this collaboration with CAPABLE.

photo:The training center

The training center was completed in November 2023. As part of the center CAPABLE have two Mitsubishi Electric SV12P die-sinking EDM machines with optional semiconductor packages

Next-generation semiconductor manufacturing is booming in Japan, with the completion of Taiwan Semiconductor Manufacturing Company (TSMC)’s new plant in Kumamoto and with Rapidus announcing plans for a plant in Hokkaido.
“In the future, large-scale plants for the front-end processes will produce massive quantities of chips, so it will be necessary to ensure the appropriate back-end process is capable of handling this volume to prevent the hollowing-out of Japan’s manufacturing industry,” claims CAPABLE President Yoichi Kawahara. Mitsubishi Electric’s die-sinking EDM machine, developed in-line with Presidents Kawahara’s vision, is contributing to maintaining and expanding Japan’s industrial structure, through the manufacture of semiconductor encapsulation dies.

photo:The words “SEMICONDUCTOR TECHNOLOGY”

The words “SEMICONDUCTOR TECHNOLOGY” are emblazoned on the front of SV-P Series die-sinking EDMs fitted with the semiconductor package option, making clear Mitsubishi Electric’s strong commitment to the semiconductor industry

SV-P Series Die-Sinking EDM Machine Semiconductor Package

With the growing spread of 5G technology and battery electric vehicles, there is increasing demand for semiconductors.
To address this need, Mitsubishi Electric has developed its semiconductor package option, which supports the production of semiconductor encapsulation molds, a vital part of the semiconductor manufacturing process.

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