Large DIPIPM
Large package common to 1200 V/600 V
Equipped with a high-performance IGBT, bootstrap diode, and an analog temperature output function, this product contributes to lower power loss and system downsizing.
Features
- Transfer molded structure achieving heat dissipation and insulation with a high thermal conductivity insulating sheet
- Directly controlled by input signals from a CPU or microcontroller using HVIC*1 with a drive circuit, protection circuit and level shift circuit
- PCB downsizing and high reliability are achieved through transition to a single power source and elimination of the photocoupler
- A lineup comprising a model offering built-in BSD with a current limiting resistor*2
- ※1：High Voltage IC, control IC with a built-in high withstand voltage level shift
- ※2：Bootstrap Diode
DIPIPM, SLIMDIP, DIPIPM+, SOPIPM, DIPPFC and CSTBT are trademarks of MITSUBISHI ELECTRIC CORPORATION.
Applications
- Home Appliance
- Motion control
- Renewable energy
- Power supply, Uninterruptable power supply (UPS)
Lineup
VCES=600V
| IC (A) | Version | |||
|---|---|---|---|---|
| Ver.6 | DataSheet | Ver.4 | DataSheet | |
| 50 | ||||
| 75 | ||||
VCES=1200V
| IC (A) | Version | |||
|---|---|---|---|---|
| Ver.6 | DataSheet | Ver.4 | DataSheet | |
| 5 | ||||
| 10 | ||||
| 15 | ||||
| 25 | ||||
| 35 | ||||
| 50 | ||||
| 75 | - | - | ||
Featured Products
1200V Large DIPIPM Ver.6 series
- Full lineup (50-75 A/600 V, 5-75 A/1200 V) with a common PCB
- Equipped with a high-performance IGBT to achieve even lower loss and temperature rise than Ver. 4
Documents
Corresponding Products
Mini DIPIPM
1200 V common package
DIPIPM+
CIB, CI type
Links to associated page
Power loss simulator
Simplified simulator to calculate power module losses and temperature rise.
FAQ
Answers to frequently asked questions.
Evaluation boards