Compact DIPIPM
The package ensures insulation distance equivalent to conventional Mini DIPIPM.
This power semiconductor module significantly reduces the footprint compared to conventional Mini DIPIPM while maintaining equivalent insulation distance, supports operation at -40°C for cold climates, and contributes to greater design flexibility and reduced environmental impact in air conditioning systems.
Features
- Reduced footprint by approximately 53% compared to conventional Mini DIPIPM series through RC-IGBT※1 integration
- Transfer molded structure achieving heat dissipation and insulation with a high thermal conductivity insulating sheet
- Achieves a smaller size than conventional Mini DIPIPM, enabling space savings on inverter boards.
- Interlock function for arm short-circuit protection simplifies inverter substrate design
- Supports continuous operation down to -40°C, enabling use in cold climates
- ※1：Reverse Conducting IGBT
DIPIPM, SLIMDIP, DIPIPM+, SOPIPM, DIPPFC and CSTBT are trademarks of MITSUBISHI ELECTRIC CORPORATION.
Applications
- Home Appliance
- Motion control
- Fan motor
Lineup
VCES=600V
| IC (A) | Type name |
|---|---|
| 30 | |
| 50 |
Featured Products
VCES=600V
| Series | Compact DIPIPM | |
|---|---|---|
| Rating current/voltage | 30A、50A/600V | 20A、30A、50A/600V |
| Built-in power chips | RC-IGBT | IGBT+FWD |
| Tjob: Operation junction temperature | - 40 ~ 150℃ | -30 ~ 150℃ |
| Tc: Module case operaiting temperature | - 40 ~ 125℃ | -30 ~ 125℃ |
| Top view of packages |  |  |
| Package size (W x D x H) | 35.6 x 24.4 x 5.4mm | 52.5 x 31 x 5.6mm |
Documents
Corresponding Products
Super mini DIPIPM
Small-capacity de facto standard package
Mini DIPIPM
1200 V common package
Links to associated page
Simulation software
Simplified simulator for quick power-module calculations.
FAQ
Answers to frequently asked questions.
Evaluation boards