Super mini DIPIPM
De facto standard package for small-capacity motor drive
The Super Mini DIPIPM™ is a transfer molded type IPM (Intelligent Power Module) that adopts a single control power source and eliminates the need for a photocoupler. It is adopted as the de facto standard package for small-capacity motor drive applications such as home electrical appliances and motion controllers.
Features
- Optimized pin layout facilitates PCB design and contributes to reduced mounting area including peripheral components
- Transfer molded structure achieving heat dissipation and insulation with a high thermal conductivity insulating sheet
- Directly controlled by input signals from a CPU or microcontroller using HVIC*1 with a drive circuit, protection circuit and level shift circuit
- PCB downsizing and high reliability are achieved through transition to a single power source and elimination of the photocoupler
- Built-in BSD*2 for reduction of external components
- ※1：High Withstand Voltage IC, High Voltage IC
- ※2：Bootstrap Diode
DIPIPM, SLIMDIP, DIPIPM+, SOPIPM, DIPPFC and CSTBT are trademarks of MITSUBISHI ELECTRIC CORPORATION.
Applications
- Air-conditioner
- Clothes Washer
- Refrigerator
- Dishwasher
- Fan
- Pump
Lineup
VCES=600V
| IC (A) | Version | |||
|---|---|---|---|---|
| Ver.7 | DataSheet | Ver.6 | DataSheet | |
| 5 | - | - | ||
| 10 | - | - | ||
| 15 | ||||
| 20 | ||||
| 30 | ||||
| 35 | - | - | ||
| 40 | - | - | ||
Featured Products
Super mini DIPIPM Ver.7 series
- New series that contributes to greater flexibility in system design and lower system costs by expanding the operating temperature range, suppressing temperature rise, and reducing noise.
- Equipped with a low-noise 7th generation CSTBT*1 which has lower noise and equivalent loss relative to the Super Mini Ver. 6 series, thus making it possible to reduce the cost of components for minimizing noise
- Expanded the maximum bonding temperature range to 175℃ to support instantaneous current flow during overload operation, etc.
- Reduces thermal resistance between chip cases and suppresses temperature rise (20 A and 30 A types)
- The terminal base has been made thicker to improve terminal strength and suppress terminal temperature rise
- The same terminal layout as the conventional product makes replacement easy
- ※1：CSTBT™: Mitsubishi Electric's unique IGBT that makes use of the carrier cumulative effect
Documents
Corresponding Products
SLIMDIP
Minimal package for insertion type
SOPIPM
SMD(Surface-mount Device) type IPM
Links to associated page
Power loss simulator
Simplified simulator to calculate power module losses and temperature rise.
FAQ
Answers to frequently asked questions.
Evaluation boards