Power Device > Product Information > IPM/DIPIPM > SUPER-MINI_DIPIPM
Super mini DIPIPM

De facto standard package for small-capacity motor drive

The Super Mini DIPIPM™ is a transfer molded type IPM (Intelligent Power Module) that adopts a single control power source and eliminates the need for a photocoupler. It is adopted as the de facto standard package for small-capacity motor drive applications such as home electrical appliances and motion controllers.

Features

  • Optimized pin layout facilitates PCB design and contributes to reduced mounting area including peripheral components
  • Transfer molded structure achieving heat dissipation and insulation with a high thermal conductivity insulating sheet
  • Directly controlled by input signals from a CPU or microcontroller using HVIC*1 with a drive circuit, protection circuit and level shift circuit
  • PCB downsizing and high reliability are achieved through transition to a single power source and elimination of the photocoupler
  • Built-in BSD*2 for reduction of external components
  • ※1:High Withstand Voltage IC, High Voltage IC
  • ※2:Bootstap Diode
DIPIPM, SLIMDIP, DIPIPM+, SOPIPM, DIPPFC and CSTBT are trademarks of MITSUBISHI ELECTRIC CORPORATION.

Applications

  • Air-conditioner
  • Clothes Washer
  • Refrigerator
  • Dishwasher
  • Fan
  • Pump

Lineup

Featured Products

Super mini DIPIPM Ver.7 series

  • New series that contributes to greater flexibility in system design and lower system costs by expanding the operating temperature range, suppressing temperature rise, and reducing noise.
  • Equipped with a low-noise 7th generation CSTBT*1 which has lower noise and equivalent loss relative to the Super Mini Ver. 6 series, thus making it possible to reduce the cost of components for minimizing noise
  • Expanded the maximum bonding temperature range to 175℃ to support instantaneous current flow during overload operation, etc.
  • Reduces thermal resistance between chip cases and suppresses temperature rise (20 A and 30 A types)
  • The terminal base has been made thicker to improve terminal strength and suppress terminal temperature rise
  • The same terminal layout as the conventional product makes replacement easy
  • ※1:CSTBT™: Mitsubishi Electric's unique IGBT that makes use of the carrier cumulative effect

Documents

Corresponding Products

SLIMDIP

Minimal package for insertion type

SOPIPM

SMD(Surface-mount device) type IPM

Links to associated page

Power loss simulator

Simplified simulator to calculate power module losses and temperature rise.

FAQ

Answers to frequently asked questions.

Evaluarion boards

Supports development of inverter equipment utilizing DIPIPM.