Built into the Future

POWER DEVICES

for a carbon neutral society

产品

产品检索 查看规格书
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驱动IC
裸芯片

应用

空调
冰箱
洗衣机
汽车
电源和UPS
太阳能发电
风力发电
运动控制
电力传输
轨道交通车辆

设计支持

应用说明
可靠性信息
评估板与参考设计
FAQ

技术信息

展览会・活动
技术论文
质量・环境
视频
功率器件百问百答

专题

SiC Power Devices
Compact DIPIPM
SiC-SLIMDIP

最新信息

最新信息
  • 2026/10/27
  • 「功率器件百问百答」页面已更新。
  • 2026/10/27
  • 「评估电路板」页面已更新。
  • 2026/09/30
  • 新建了“技术信息”页面。
  • 2026/09/30
  • 新增了“功率器件百问百答”页面。
  • 2026/09/01
  • 我们对产品搜索页面进行了大幅改版。
  • 2026/07/27
  • 我们在视频内容页面添加了以下视频：“Mitsubishi Electric Europe - Semiconductor at PCIM Expo 2026”。
  • 2026/07/27
  • 新产品“WF0007Q-1200AA”和“WF0005Q-0750AA”已添加到“SiC MOSFET 裸芯片产品页面”。
  • 2026/06/25
  • Inverter Prototype 页面已更新。
  • 2026/05/28
  • “Compact DIPIPM”页面新增了技术论文。
  • 2026/05/28
  • “SiC SLIMDIP”页面新增了技术论文。
  • 2026/04/23
  • 新产品“CM1200HC-90XB”和“CM1200HG-90XB”和“CM1500HC-66XB”已添加到“High Voltage SiC 产品页面”。
  • 2026/02/23
  • 【2026年3月22日至26日，美国德克萨斯州】 我们将参加 "APEC 2026"。
  • 2026/02/23
  • 应用说明 "Comact DIPIPM" 已发布。
  • 2026/02/23
  • 新产品“FMF800E1C-66BEW”和“FMF800E3C-66BEW”已添加到“High Voltage SiC 产品页面”。
  • 2026/02/23
  • 我们发布了一段介绍“新型 8 英寸 SiC 功率半导体工厂”的视频。
  • 2026/02/23
  • "可靠性信息"已更新了。
  • 2026/01/20
  • "SiC MOSFET 裸芯片产品页面”已更新。
  • 2026/01/20
  • "可靠性信息"已更新了。
  • 2025/12/23
  • [2026年1月，东京] 我们将参加 NEPCON JAPAN 2026 - POWER DEVICE & MODULE EXPO。
  • 2025/12/23
  • SiC功率器件 "Lecture Series" 内容已添加。
  • 2025/11/21
  • 我们新发布了 "SiC SLIMDIP系列" 产品页面，该系列产品采用 SLIMDIP 封装的 SiC 器件。
  • 2025/11/21
  • SiC功率器件 "Lecture Series" 内容已添加。
  • 2025/11/21
  • 展览会・活动页面已更新。
新闻发布（英语）
  • 2026/06/08
  • Mitsubishi Electric and Semikron Danfoss Jointly Develop New Standard Package for Power Semiconductor Modules
  • 2026/06/05
  • Mitsubishi Electric to Launch Data-provision Service to Accelerate Adoption of Latest Power Semiconductors
  • 2026/06/04
  • Mitsubishi Electric to Ship 5th-generation SiC-MOSFET Bare Die Samples
  • 2026/05/19
  • Mitsubishi Electric to Ship Samples of NX-type 1.2kV IGBT Module for Industrial Use
  • 2026/03/27
  • Mitsubishi Electric, ROHM and Toshiba Electronic Devices & Storage Discussing Integration of Power Device and Semiconductor Businesses
  • 2026/03/26
  • Mitsubishi Electric Comments on Media Reports Regarding its Power Semiconductor Business
  • 2026/01/14
  • Mitsubishi Electric to Ship Samples of Four New Trench SiC-MOSFET Bare Dies for Power Semiconductors
  • 2026/01/14
  • Mechanism of Hydrogen-driven Free-electron Generation in Silicon Elucidated for First Time Ever
  • 2025/12/02
  • Mitsubishi Electric to Launch Two New XB Series HVIGBT Modules
  • 2025/10/15
  • Mitsubishi Electric to Collaborate with ITRI in Taiwan on Large Capacity Power-conversion Systems Using Power Semiconductors
  • 2025/09/11
  • Mitsubishi Electric to Ship Compact DIPIPM Series of Semiconductor Modules Samples
  • 2025/06/10
  • Mitsubishi Electric and GE Vernova to Strengthen Cooperation on Power Semiconductors for HVDC Transmission Systems
  • 2025/05/28
  • Mitsubishi Electric IR Day 2025
  • 2025/04/15
  • Mitsubishi Electric to Ship Full-SiC and Hybrid-SiC SLIMDIP Samples
  • 2025/04/08
  • Mitsubishi Electric to Ship Samples of XB Series HVIGBT Module
  • 2025/01/30
  • Mitsubishi Electric Joins Horizon Europe’s “FLAGCHIP” Project to Develop Technology for Monitoring Power Module Condition
  • 2025/01/14
  • Mitsubishi Electric to Ship Samples of LV100 1.2-kV IGBT Module for Industrial Use
  • 2024/12/23
  • Mitsubishi Electric to Ship Samples of S1-Series HVIGBT Module
  • 2024/11/20
  • Mitsubishi Electric's Power Device Works to Construct New Plant
  • 2024/11/12
  • Mitsubishi Electric to Ship Samples of SiC-MOSFET Bare Die for xEVs
  • 2024/09/30
  • Mitsubishi Electric Begins Supplying Power Semiconductor Chips Made from 12-inch Wafers for Semiconductor Module Assembly
  • 2024/06/10
  • Mitsubishi Electric Ships Two New SBD-embedded SiC-MOSFET Modules
  • 2024/06/06
  • Mitsubishi Electric to Launch Support Service for Accelerated System Development with LV100 Power Semiconductors
  • 2024/05/29
  • Mitsubishi Electric IR Day 2024
  • 2024/03/26
  • Mitsubishi Electric Sustainability Briefing
  • 2024/01/23
  • Mitsubishi Electric to Release J3-Series SiC and Si Power Module Samples
  • 2023/11/13
  • Mitsubishi Electric and Nexperia to Partner in Joint SiC Power Semiconductors Development
  • 2023/10/24
  • Mitsubishi Electric Plays Lead Role in Drafting 2023 IEC White Paper
  • 2023/10/10
  • Mitsubishi Electric to Invest in Coherent’s New SiC Business
  • 2023/08/29
  • Mitsubishi Electric Completes Installation of 12-inch Wafer Processing Line at its Fukuyama Factory Power Device Works
  • 2023/07/28
  • Mitsubishi Electric Buys Stake in Novel Crystal Technology to Accelerate Development of Gallium-oxide Power Semiconductors
  • 2023/06/13
  • Mitsubishi Electric to Ship Samples of NX-type Full-SiC Power Semiconductor Modules for Industrial Equipment
  • 2023/06/01
  • Mitsubishi Electric Develops SBD-embedded SiC-MOSFET with New Structure for Power Modules
  • 2023/05/29
  • Mitsubishi Electric IR Day 2023
  • 2023/05/26
  • Mitsubishi Electric and Coherent Enter into A Collaboration to Scale Manufacturing of SiC Power Electronics on A 200 mm Technology Platform
  • 2023/05/08
  • Mitsubishi Electric to Ship Samples of SBD-embedded SiC-MOSFET Module
  • 2023/04/25
  • Mitsubishi Electric to Ship Samples of HV100 Dual-type X-Series HVIGBT Module
  • 2023/03/14
  • Mitsubishi Electric to Construct New Wafer Plant to Boost SiC Power Semiconductor Business