POWER DEVICES

• Apr 23, 2026
• The download files for simulation software "3D CAD" updated.

• Apr 23, 2026
• New products "CM1200HC-90XB"、"CM1200HG-90XB"、"CM1500HC-66XB" have been added to the "High Voltage SiC Product Page".

• Mar 27, 2026
• We have added "SPICE Model" to the Simulator page. Also, the download files for "3D CAD" updated.

• Feb 23, 2026
• 【March 22-26, 2026, Texas USA】 We will exhibit at "APEC 2026".

• Feb 23, 2026
• The download files for simulation software "PLECS" updated.

• Feb 23, 2026
• Application note "Comact DIPIPM" has been posted.

• Feb 23, 2026
• New products "FMF800E1C-66BEW" and "FMF800E3C-66BEW" have been added to the "High Voltage SiC Product Page".

• Feb 23, 2026
• We have posted a video introducing the "New 8 inch SiC power semiconductor plant".

• Feb 23, 2026
• "Reliability Information" updated

• Jan 20, 2026
• "SiC MOSFET Bare Die Product page"has been updated.

• Jan 20, 2026
• The download files for simulation software "PLECS" updated.

• Jan 20, 2026
• "Reliability Information" updated

• Dec 23, 2025
• [Tokyo, January 2026] We will be exhibiting at NEPCON JAPAN 2026 - Power Device and Module Expo.

• Dec 23, 2025
• SiC Power Device "Lecture Series" content has been added.

• Nov 21, 2025
• We have posted a new product page for the "SiC SLIMDIP Series," which features SiC devices equipped in SLIMDIP package.

• Nov 21, 2025
• SiC Power Device "Lecture Series" content has been added.

• Nov 21, 2025
• The Exhibition & Event page has been updated.

• Oct 23, 2025
• We have added "3D CAD" to the "Simulator" page. Also, the download files for "PLECS" updated.

• Oct 23, 2025
• We have added the following video to the video content page: "Pioneering the Future with Semiconductors".

• Oct 23, 2025
• SiC Power Device "Lecture Series" content has been added.

• Sep 18, 2025
• We have newly posted a page for the "Compact DIPIPM Series," which has a significantly reduced the footprint compared to conventional Mini DIPIPM.

• Sep 18, 2025
• We have added "PLECS" to the "Simulator" page, in addition to the existing "MELCOSIM."

• Sep 18, 2025
• SiC Power Device "Lecture Series" content has been added.

• Aug 07, 2025
• A new page for the "J3 series" of SiC/Si modules for automobiles has been posted.

• Aug 07, 2025
• RC-IGBT has been added to the bare die page.

• Aug 07, 2025
• SiC Power Device "Lecture Series" content has been added.

• Mar 27, 2026
• Mitsubishi Electric, ROHM and Toshiba Electronic Devices & Storage Discussing Integration of Power Device and Semiconductor Businesses

• Mar 26, 2026
• Mitsubishi Electric Comments on Media Reports Regarding its Power Semiconductor Business

• Jan 14, 2026
• Mitsubishi Electric to Ship Samples of Four New Trench SiC-MOSFET Bare Dies for Power Semiconductors

• Jan 14, 2026
• Mechanism of Hydrogen-driven Free-electron Generation in Silicon Elucidated for First Time Ever

• Dec 02, 2025
• Mitsubishi Electric to Launch Two New XB Series HVIGBT Modules

• Oct 15, 2025
• Mitsubishi Electric to Collaborate with ITRI in Taiwan on Large Capacity Power-conversion Systems Using Power Semiconductors

• Sep 11, 2025
• Mitsubishi Electric to Ship Compact DIPIPM Series of Semiconductor Modules Samples

• Jun 10, 2025
• Mitsubishi Electric and GE Vernova to Strengthen Cooperation on Power Semiconductors for HVDC Transmission Systems

• May 28, 2025
• Mitsubishi Electric IR Day 2025

• Apr 15, 2025
• Mitsubishi Electric to Ship Full-SiC and Hybrid-SiC SLIMDIP Samples

• Apr 08, 2025
• Mitsubishi Electric to Ship Samples of XB Series HVIGBT Module

• Jan 30, 2025
• Mitsubishi Electric Joins Horizon Europe’s “FLAGCHIP” Project to Develop Technology for Monitoring Power Module Condition

• Jan 14, 2025
• Mitsubishi Electric to Ship Samples of LV100 1.2-kV IGBT Module for Industrial Use

• Dec 23, 2024
• Mitsubishi Electric to Ship Samples of S1-Series HVIGBT Module

• Nov 20, 2024
• Mitsubishi Electric's Power Device Works to Construct New Plant

• Nov 12, 2024
• Mitsubishi Electric to Ship Samples of SiC-MOSFET Bare Die for xEVs

• Sep 30, 2024
• Mitsubishi Electric Begins Supplying Power Semiconductor Chips Made from 12-inch Wafers for Semiconductor Module Assembly

• Jun 10, 2024
• Mitsubishi Electric Ships Two New SBD-embedded SiC-MOSFET Modules

• Jun 06, 2024
• Mitsubishi Electric to Launch Support Service for Accelerated System Development with LV100 Power Semiconductors

• May 29, 2024
• Mitsubishi Electric IR Day 2024

• Mar 26, 2024
• Mitsubishi Electric Sustainability Briefing

• Jan 23, 2024
• Mitsubishi Electric to Release J3-Series SiC and Si Power Module Samples

• Nov 13, 2023
• Mitsubishi Electric and Nexperia to Partner in Joint SiC Power Semiconductors Development

• Oct 24, 2023
• Mitsubishi Electric Plays Lead Role in Drafting 2023 IEC White Paper

• Oct 10, 2023
• Mitsubishi Electric to Invest in Coherent’s New SiC Business

• Aug 29, 2023
• Mitsubishi Electric Completes Installation of 12-inch Wafer Processing Line at its Fukuyama Factory Power Device Works

• Jul 28, 2023
• Mitsubishi Electric Buys Stake in Novel Crystal Technology to Accelerate Development of Gallium-oxide Power Semiconductors

• Jun 13, 2023
• Mitsubishi Electric to Ship Samples of NX-type Full-SiC Power Semiconductor Modules for Industrial Equipment

• Jun 01, 2023
• Mitsubishi Electric Develops SBD-embedded SiC-MOSFET with New Structure for Power Modules

• May 29, 2023
• Mitsubishi Electric IR Day 2023

• May 26, 2023
• Mitsubishi Electric and Coherent Enter into A Collaboration to Scale Manufacturing of SiC Power Electronics on A 200 mm Technology Platform

• May 08, 2023
• Mitsubishi Electric to Ship Samples of SBD-embedded SiC-MOSFET Module

• Apr 25, 2023
• Mitsubishi Electric to Ship Samples of HV100 Dual-type X-Series HVIGBT Module

• Mar 14, 2023
• Mitsubishi Electric to Construct New Wafer Plant to Boost SiC Power Semiconductor Business